MICROFAB® AU3151

Mild alkaline non-cyanide high-purity hardness gold electroplating process with proven reliability and bondability.

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Product Overview

MICROFAB Au3151 enables high-hardness gold bumping through the use of an organic hardness adjuster—something not achievable with conventional gold processes. It is ideal for semiconductor wafer applications requiring gold bump plating or minimal grain growth during heat treatment. 

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