354 results for "Alpha"
NOVAFAB® NANOTWIN Cu
A high-purity copper electroplating process formulated for fabricating pillars or pads for hybrid bonding applications.
Learn moreEvents
Visit us at these events to learn about our next-generation solutions for electronics design and manufacturing.
Learn moreNickel Alloys
MICROFAB® NiFe 1000 and NOVAFAB® NiFe 2000 electrolytic nickel/iron alloy plating processes, designed for MEMs and WLP applications.
Learn moreElement Solutions Inc Completes Acquisition of Micromax® Business
Element Solutions Inc (ESI) announced the completion of its acquisition of the Micromax conductive pastes and inks business.
Learn moreNickel Solutions
Nickel sulfamate processes, including boric acid-free options, produce pure, ductile, fine-grained, matte, low-stress deposits.
Learn moreMICROFAB® SC-40 PLUS
Next-generation high-speed copper plating process delivers high-purity deposits with cutting-edge uniformity.
Learn moreMICROFAB® TS-650 NXG
Tin-silver bump metallization bath allows high-speed electro-deposition of smooth, fine-grained, uniform tin silver alloy bumps.
Learn moreNEPCON Thailand 2026
Bangkok International Trade & Exhibition Centre (BITEC)
Booth 9E11
June 17–20, 2026
Bangkok, Thailand
Unveiling Next-Generation Solder & Sinter Solutions at productronica China 2025
Showcasing advancing innovation and sustainability in Power Electronics – visit MacDermid Alpha at booth 470, hall A
Learn moreNext-generation Tin Silver Bump Metallization Process improves precision, reliability, and performance.
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry is pleased to announce the launch of MICROFAB® TS-650 NXG...
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