Juarez Expo & Tech Forum
CIITA - IPN Chihuahua
Discover MacDermid Alpha’s low voiding solutions which increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Additionally, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum.
MacDermid Alpha has a portfolio of low voiding solutions that increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Featured solder pastes include ALPHA OM-358 and Kester NP650 and the ALPHA HiTech portfolio of adhesive, underfill, and edgebond solutions.