JPCA Show 2026

MacDermid Alpha is proud to announce our participation at JPCA 2026. Meet our technology experts to explore how we are advancing high-reliability printed circuit board and IC substrate fabrication with our latest innovations in pulse plating, via fill and direct metallization. Our solutions are designed to support the most demanding markets including high-performance computing and artificial intelligence (AI), where speed, reliability, and scalability are critical.

Explore our high-performance chemistries for advanced interconnects:

PC 610: Industry-leading pulse plating process designed to provide excellent throwing power within through-holes, surface copper thickness, and surface copper variation.

Systek™ IC Substrate Solutions: From trace plating to blind via and through-hole filling, our Systek acid copper electroplating technology delivers flexible, reliable results for complex fine-line and through-hole designs, maximizing IC substrate performance.

MacuSpec™ Via Fill Technologies: Achieve exceptional copper via filling with our MacuSpec VF-TH 500 and MacuSpec AVF 700 processes, industry-proven solutions that deliver unmatched stability and reliable performance, even in complex High-Density Interconnect (HDI) applications.

Shadow® Plus: Our most advanced graphite-based direct metallization technology, Shadow Plus, is designed to meet the industry’s need for increased functionality and complex board designs, while delivering substantial sustainability benefits over traditional electroless copper primary metallization.  

Featured Technical Presentation:  

• Topic: Enhancing Flip Chip BGA Substrate Performance Using SYSTEK™ PC 610 Pulse Reverse Copper Plating
• Speaker: Steven Tam – Product Director, IC Substrates
• Date/Time: June 10, 14.55 – 15.15 – Seminar venue 4

Don’t miss this opportunity to connect with our team and discover how we’re shaping the future of electronics!

Register Here