Advanced Materials for High-Reliability Applications
Watch this complimentary webinar on Advanced Materials for High-Reliability Applications
Ebad Rehman
Global Product Manager, Solder Paste
Ebad focuses on surface mount technology materials for high-reliability automotive, communications, and computing applications, with an emphasis on thermomechanicalperformance and low-temperature assembly solutions. He holds aBachelor’s degree in Electrical Engineeringand aMaster’s degree in Technology Management. He has been with MacDermid Alpha for more than five years and has spearheaded multiple product development initiatives.
Automotive electronics, advanced packaging, and high-performance computing applications continue to place greater demands on board-level reliability under thermal and mechanical stress conditions.
Join Ebad Rehman for Advanced Materials for High-Reliability Applications on May 29 at 4:00 PM IST. The webinar will examine how material selection influences reliability under thermal cycling, vibration, and high-density design constraints, with a focus on high-reliability alloy systems for advanced electronics assemblies.
Attendees will gain insight into four key areas:
• How material behavior influences board-level reliability
• Approaches to managing thermomechanical stress in dense assemblies
• Considerations for electrochemical reliability
• Strategies that support long-term performance without adding process complexity
How You Can Support This Webinar
The live session is focused on audiences across India and Southeast Asia, with on-demand access available following the event.
MacDermid Alpha colleagues can help extend webinar reach by:
• Sharing the registration link with customers, partners, and prospects
• Promoting the webinar through LinkedIn and customer engagement activities
• Connecting interested attendees with the team for technical discussions on reliability challenges and material selection