Brands
Our recognized, industry-leading brands deliver the innovation, reliability, and lowest total cost of ownership required in today’s competitive markets.
Explore Our Brands
STAYDRY®
Advanced moisture, particle, and hydrogen getters designed to enhance performance and reliability across diverse applications.
Explore ProductsSTAYSTIK®
Versatile adhesives delivering reliable mechanical, electrical, and thermal bonding for both temporary and permanent applications.
Explore ProductsSterling®
Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.
Explore ProductsSystek™
Comprehensive IC substrate metallization processes for RDL, through-hole filling, and embedded traces.
Explore ProductsTensoRed®
Reliable, cost-efficient stencil tensioning that ensures consistent performance without the need for air pressure.
Explore ProductsTetrabond®
Innovative "frameless" stencils for safer, more secure mounting and demounting.
Explore ProductsTrueHeight®
Preforms that ensure consistent bondline thickness, reducing die tilt in assembly.
Explore ProductsVia Dep®
Low-stress electroless copper for PTH and micro-via metallization, with reliable, horizontal processing.
Explore ProductsViaForm®
Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.
Explore ProductsXMAPP™
Comprehensive guidance and expertise with XtraForm® materials, process mapping, product design, and production processes.
Learn MoreXtraForm®
High-performance hardcoated, formable 3D films for durable, seamless integration of electronics in automotive surfaces.
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