Brands
Our recognized, industry-leading brands deliver the innovation, reliability, and lowest total cost of ownership required in today’s competitive markets.
Explore Our Brands
HiFlo®
Purest, high-fluidity solder made from virgin metals for unmatched performance and minimal dross.
Explore ProductsHiTech®
Drop Shock, Impact Bend, and ATC-tested adhesives, underfills, and encapsulants for soldered components.
Explore ProductsInnolot®
High-reliability, lead-free solder alloy for robust performance in harsh environments.
Explore ProductsKester®
Circuit board assembly materials including traditional soldering chemicals, paste, wire, and bar products.
Learn MoreM-Copper Omega®
Premium electroless copper for primary PCB metallization, ensuring high reliability.
Explore ProductsMacuSpec™
High-performance electrolytic copper processes for the plating of through holes and filling of micro vias.
Explore ProductsMICROFAB®
High-quality copper, gold, and solder for WLP, meeting demands of IDM, OSAT, and foundries.
Explore ProductsMicromax™
Micromaxtm Electronic Inks and Pastes are highly reliable thick film inks, pastes, ceramic tapes and printed electronic inks.
Learn MoreMultiPrep
Advanced copper treatment, promoting adhesion for innerlayer and soldermask applications.
Explore ProductsNOVAFAB®
Advanced Cu, Ni, Pd, Ag, and Au solutions for WLP, meeting the demands of IDM, OSAT, and foundries.
Explore ProductsORMECON®
Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.
Explore ProductsPALLADEX®
Electrolytic palladium plating for reliable connectors and interconnects.
Explore ProductsPowerBond®
High-strength solder with superior thermal fatigue, close to high-lead alloy performance.
Explore ProductsReliance®
A unique, patent-pending reliability toolset integrating solder and polymer data insights for unmatched circuit board assembly perform
Learn MoreShadow®
Sustainable graphite-based direct metallization, a cleaner alternative to electroless copper.
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