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Conductive Die Attach Products
ATROX conductive die attach products offer a complete solution with lower total cost of ownership ushering in a new era of high performance materials.
ATROX CF 200-1 D
ATROX CF 2001 D
Features
- ATROX CF200-1D is a conductive film adhesive with high electrical and thermal conductive properties.
- The unique chemistry allows excellent process flexibility and superior reliability performance to a variety of die sizes used for semiconductor applications.
High Thermal Conductivity Die Attach Film
ATROX CF200-1D is a conductive film adhesive with high electrical and thermal conductivity properties. The unique chemistry allows excellent process flexibility and superior reliability performance for a variety of die sizes used for semiconductor applications.
The film has excellent adhesion to silicon wafers as well metallized dies and is commonly used for leadframe surface finishes such as bare Cu, Ag and NiPdAu.
ATROX CF200-1D
|
Product Name |
Die Attach Format |
DA Functional Property |
Die Attach Technology |
|---|---|---|---|
|
ATROX CF200-1D |
Film |
Conductive |
Polymer |
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