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- Circuit Board Assembly
  Driving PCB technology with leading-edge electronic materials for high-reliability in complex Circuit Board Assemblies (CBAs).
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  - Circuit Board Protection
    Safeguard electronics with advanced potting compounds and conformal coatings, ensuring durability in any environment.
    
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    Conformal Coatings
    Protect your PCBAs with conformal coatings for enhanced durability and reliability in demanding environments.
    
    Potting Compounds
    Protect PCBAs with potting compounds and resins that form a complete barrier, ensuring superior performance in harsh environments
    
    Circuit Board Protection
    
    Safeguard electronics with advanced potting compounds and conformal coatings, ensuring durability in any environment.
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  - Contact Lubricants
    Prolong component life, reduce wear and hot spots with proven contact lubricants, boosting electrical efficiency.
    
    Contact Lubricants
    
    Prolong component life, reduce wear and hot spots with proven contact lubricants, boosting electrical efficiency.
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  - Electronic, General Purpose Cleaning
    Deliver contaminant-free components with single-stage cleaning solutions, optimizing operation and high-performance.
    
    Electronic, General Purpose Cleaning
    
    Deliver contaminant-free components with single-stage cleaning solutions, optimizing operation and high-performance.
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  - Polymer Reinforcement
    Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.
    
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    Adhesives & Encapsulants
    Achieve strong reinforcement for electrical components in diverse applications with our high-performance adhesives and encapsulants.
    
    Edgebonds
    Improve reliability and boost manufacturing efficiency with heat-curable epoxies to reinforce advanced BGA packages.
    
    Underfills
    Enhance reliability in complex semiconductor packages with heat-curable reinforced epoxies designed for capillary underfill.
    
    Polymer Reinforcement
    
    Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.
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  - Solder Recycling
    Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.
    
    Solder Recycling
    
    Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.
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  - Surface Mount Technology
    Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.
    
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    Cored Solder Wire (SMT)
    Ensure robust performance in critical assemblies with high-reliability cored solder wire designed for primary attach and rework.
    
    Electronic Cleaners (SMT)
    Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.
    
    Preforms
    Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.
    
    Solder Alloys
    Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.
    
    Solder Pastes
    Meet demands for miniaturization, reliability, and yield with advanced solutions providing a wide processing window to lower TCO.
    
    Stencil Solutions
    Optimize assembly with solutions addressing today’s printing needs through rapid response, high accuracy, and exceptional performance.
    
    Surface Mount Technology
    
    Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.
    
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  - Thermal Management
    Enhance device performance and longevity with high-performance materials that efficiently dissipate heat.
    
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    Liquid Gap Fillers
    Advanced thermal management solutions that deliver efficient heat dissipation and long-term system reliability.
    
    Thermal Pastes
    Address heat dissipation challenges with efficient heat transfer for optimal performance and reliable thermal management.
    
    Thermal Management
    
    Enhance device performance and longevity with high-performance materials that efficiently dissipate heat.
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  - Through Hole Assembly
    Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.
    
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    Cored Solder Wire
    Ensure robust performance in critical assemblies with high-reliability cored solder wire designed for primary attach and rework.
    
    Electronic Cleaners
    Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.
    
    Liquid Flux
    Enhance quality and performance with high-reliability formulations for assemblies using diverse pad finishes and thicknesses.
    
    Solder Alloys
    Ensure reliable PCB assembly with high-quality solder alloys that form strong, durable joints for diverse end-use applications.
    
    Through Hole Assembly
    
    Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.
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  Pioneering Solutions for Optimal PCB Assembly Performance
  
  We provide next-generation material solutions that enhance performance in demanding applications, enabling advanced technology, supporting high reliability, and optimizing throughput and yields for greater efficiency and value.
- Circuitry Solutions
  Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.
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  - Circuit Formation
    Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-gen applications.
    
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    Ammoniacal Etchants
    Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.
    
    Innerlayer Adhesion Promotion
    Ensure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.
    
    Leadframe Adhesion Promotion
    Achieve MSL-1 performance and reliability with our adhesion promotors, from leadframe roughening to sidewall solderability enhancement.
    
    Molded Interconnect Device
    Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.
    
    Process Chemicals
    Achieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.
    
    Solder Mask & Dry Film Adhesion
    Ensure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.
    
    Circuit Formation
    
    Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-gen applications.
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  - Connector Plating
    Ensure durability and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.
    
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    Electronic Connector Plating
    Achieve bright, matte, low-stress finishes with high-efficiency electronic plating solutions that enhance durability and reliability.
    
    Precious Metal Solutions
    Get corrosion-resistant, durable finishes with our high-speed, stable precious metal plating processes for demanding applications.
    
    Connector Plating
    
    Ensure durability and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.
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  - Electrolytic Copper Metallization
    Maximize precision in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.
    
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    High-Throw DC
    Create advanced mid-aspect-ratio boards with high-throw DC acid copper plating that boosts performance, reliability, and versatility.
    
    Periodic Pulse Reverse
    Ensure reliable plating for thick, multi-layer PCBs with PPR solutions, offering uniform coverage of high-aspect-ratio through-holes.
    
    Via Fill
    Optimize your PCB designs with high-performance copper via filling solutions, engineered to tackle any metallization challenge.
    
    Electrolytic Copper Metallization
    
    Maximize precision in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.
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  - IC Substrates
    Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.
    
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    Acid Copper Technologies
    Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
    
    Copper Adhesion Promotion
    Drive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
    
    Final Finishes
    Meet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.
    
    Panel Level Packaging
    Portfolio of advanced solutions for enhanced uniformity, coplanarity, reliability, and precision for advanced packaging.
    
    SAP Technologies
    Produce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.
    
    IC Substrates
    
    Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.
    
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  - Memory Disk
    Lay the foundation for reliable performance in complex designs with our engineered primary metallization systems.
    
    Memory Disk
    
    Lay the foundation for reliable performance in complex designs with our engineered primary metallization systems.
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  - PCB Surface Finishes
    Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.
    
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    ENEPIG
    Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
    
    ENIG
    Exceed IPC quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
    
    Immersion Silver
    Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
    
    Immersion Tin
    Gain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
    
    Organic Solderability Preservative
    Explore OEMs' preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
    
    PCB Surface Finishes
    
    Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.
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  - Primary Metallization
    Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.
    
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    Conductive Polymers
    Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.
    
    Direct Metallization
    Achieve sustainability, cost savings, and reliability with our conductive hole-making processes that outperform traditional methods.
    
    Electroless Copper
    Optimize the performance of multilayer boards with high-reliability electroless copper plating for demanding PCB applications.
    
    Primary Metallization
    
    Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.
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  High Performance Printed Circuit Board (PCB) Materials
  
  Our chemistries are designed to meet reliability and performance goals, addressing industry challenges for today’s electronic devices. We deliver innovative, sustainable solutions to a diverse range of markets in the rapidly evolving electronics industry.
- Film & Smart Surface Solutions
  Functional Films & Smart Surfaces for Seamless Interfaces. 
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  - Circuit Materials
    High-performance materials designed for flexible, formable, and reliable circuits in innovative electronics applications.
    
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    Flexible Electronics Inks
    Drive sustainable innovation with eco-friendly conductive, dielectric, and carbon inks for bonded flexible printed circuits (FPCs).
    
    In-Mold Electronics Inks
    Enable highly reliable 3D In-Mold Electronic (IME) smart surfaces with our easy-to-use conductive, dielectric, and carbon inks.
    
    Inks for Medical Sensors
    The combination of functional inks with Autostat films enables the fabrication of biosensors, and medical electrodes.
    
    Circuit Materials
    
    High-performance materials designed for flexible, formable, and reliable circuits in innovative electronics applications.
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  - First Surface Hardcoated Films for Smart Interfaces
    First Surface Hardcoated Films for Smart Interfaces
    
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    Hardcoated Films for 2D Interfaces
    Increase interface durability and flexibility with textured hardcoated polyester and polycarbonate films for switches and overlays.
    
    Hardcoated Films for 3D Components
    Achieve seamless, high-quality finishes with hardcoated films offering deep formability, durability, and aesthetics for automobiles.
    
    First Surface Hardcoated Films for Smart Interfaces
    
    First Surface Hardcoated Films for Smart Interfaces
    
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  - Screen Printing Materials
    Optimize stencil life and simplify prep with high-quality films, emulsions, and chemicals for superior print results every time.
    
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    Screen Preparation Chemicals
    Enhance all stages of the screen print process with our mesh preparation, cleaning, and stencil reclaim chemicals.
    
    Screen Printing Accessories
    Enable high-quality print reproduction with critical accessories for screen print stencil preparation.
    
    Screen Printing Emulsions
    Ensure superior stencil preparation with our trusted range of screen print emulsions.
    
    Screen Printing Stencil Films
    Achieve superior screen print stencils with our photosensitive stencil films, including Capillex and Fivestar.
    
    Screen Printing Materials
    
    Optimize stencil life and simplify prep with high-quality films, emulsions, and chemicals for superior print results every time.
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  A Unique Portfolio of Materials and Expertise for Smart Surfaces
  
  From simple labels to sophisticated automotive smart surfaces and displays, our flexible films, formable films, and circuit inks enable efficient design and high-yield production of durable, attractive Human Machine Interfaces (HMIs).
- Semiconductor Assembly
  Advancing innovative electronics with reliable bondline materials for electronics, photomasks, die attach, packaging and camera modules.
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  - Advanced Interconnect Assembly
    Enhance thermal efficiency and precision with our solder TIM, solder, and flux solutions for advanced chip fabrication.
    
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    Interconnect Solder Paste
    Advanced solder solutions for interconnecting semiconductor packages, from laminate to leadframe packaging.
    
    Semiconductor Solder Flux
    Our Semiconductor fluxes for CSP, flip chip, and BGA ball attach deliver high yields, stable performance, and easy DI water cleanup.
    
    Solder Thermal Interface Material
    Optimize heat management with our Solder Thermal Interface Materials (TIMs).
    
    Advanced Interconnect Assembly
    
    Enhance thermal efficiency and precision with our solder TIM, solder, and flux solutions for advanced chip fabrication.
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  - Camera Modules
    Camera module adhesives for secure assembly and peak performance.
    
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    Adhesives - Camera Modules
    Ensure durable camera module assembly.
    
    Camera Modules
    
    Camera module adhesives for secure assembly and peak performance.
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  - Microelectronics and Sensors
    Optimize electronics performance with getters and marking inks for superior bonding and chemical resistance improving device lifespan.
    
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    Getters
    Enhance reliability and performance of hermetic packages.
    
    Marking Inks
    Ensure long-lasting identification with durable, high-quality marking inks.
    
    Thermoplastic Adhesives
    Achieve reliable bonds with flexible thermoplastic adhesives.
    
    Thermoset Adhesives
    Secure strong bonds for durable performance.
    
    Microelectronics and Sensors
    
    Optimize electronics performance with getters and marking inks for superior bonding and chemical resistance improving device lifespan.
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  - Photomasks
    Maximize yield and reduce cost of ownership with reliable Compugraphics photomasks delivered with fast cycle times.
    
    Photomasks
    
    Maximize yield and reduce cost of ownership with reliable Compugraphics photomasks delivered with fast cycle times.
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  - Power Electronics
    Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.
    
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    Die Attach - Sinter
    Ensure reliable bonds with advanced sintering materials.
    
    Package Attach - Sinter
    Ensure long-lasting bonds with advanced sintering materials.
    
    Power Electronics Preforms
    Achieve precision with reliable solder preforms for power electronics.
    
    Top Attach - Sinter
    Secure reliable bonds with advanced sintering materials.
    
    Power Electronics
    
    Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.
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  - Standard Die Attach
    Attain high-precision, reliable bonding with our die attach solutions for advanced semiconductor assembly.
    
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    Conductive
    Enhance Performance with ATROX^® Conductive Materials
    
    Hybrid Sintering
    Boost Reliability with ATROX Hybrid Sintering
    
    Standard Die Attach
    
    Attain high-precision, reliable bonding with our die attach solutions for advanced semiconductor assembly.
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  Engineered Thermal Management Solutions
  
  Top-side, die attach, and package attach for power electronics. High-, mid-, low-thermal, non-conductive die attach materials, flip chip & BGA fluxes, fine-feature solder paste, and sTIM.
- Wafer Level Packaging
  Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
  Advanced Packaging Solutions
  
  Our materials maximize semiconductor performance and reliability for next-generation technologies. With an agile and flexible development process, we deliver unique solutions that provide the lowest cost of ownership and the fastest time to market.
Boosting PCB, IC substrate, semiconductor & display performance.

We are the market leader of innovative, integrated specialty chemicals and material technologies which shape the future of circuitry, semiconductors, board assembly, and smart surfaces; improving performance and reliability of electronics products.
Solutions & Sustainability
- Interconnect
  
  Our Interconnect Solutions
  
  Our metallization and wafer level packaging technologies enable complex, high-density interconnect designs. We provide advanced solutions for direct metallization of printed circuit boards, semi-additive copper metallization on IC substrates, and copper plating for TSV interconnects.
  When applied in wafer-level packaging, PCB fabrication, and semiconductor assembly, our solutions deliver seamless electrical performance and long-term reliability, reinforcing our commitment to innovation and excellence in connectivity.
- Connect
  
  Our Connect Solutions
  
  We enable reliable circuit pathways that enhance connectivity in high-density designs. Our board-level assembly, circuit fabrication, standard die attach, top-side attach, and package attach solutions create strong, durable bonds with excellent electrical and thermal conductivity for advanced performance.
- Reinforce
  
  Our Reinforce Solutions
  
  Our precision bonding technologies reinforce critical components with advanced mechanical and adhesive properties, ensuring reliability and optimal performance in next-generation electronics, even in the harshest of environments.
- Protect
  
  Our Protect Solutions
  
  Formulated to withstand physical shock, vibration, corrosion, and thermal stress, our protective solutions extend component lifespan and reduce risk of failure.
  When used in circuit board assembly, our technologies deliver durable protection and consistent performance, reinforcing our commitment to enhanced device reliability.
- Thermal Management
  
  Our Thermal Management Solutions
  
  We offer a wide range of thermal interface material (TIM) solutions for circuit board and semiconductor assembly in high-powered electronics, delivering superior thermal performance without compromising device miniaturization or system complexity.
  Our combined solutions ensure optimal thermal regulation, reinforcing our expertise in maintaining device efficiency and reliability.
- Haptics & Touch
  
  Our Haptic & Touch Solutions
  
  Our formable and flexible films, combined with advanced circuit materials, enable innovative designs and high-yield production of durable, visually striking Human Machine Interfaces (HMIs).
  We create immersive, responsive user experiences that reinforce our leadership in advanced haptic solutions for next-generation devices.
Solutions at Every Step

Our electronic solutions support every stage of manufacturing, from wafer fabrication to final assembly, complemented by smart surface films and in-mold electronics solutions.
Brands
- AccuFlux^®
  
  AccuFlux^®
  
  Precision micro-flux coatings reduce voids, enhance joint integrity, and set new standards for soldering performance.
- ActiveCopper^™
  
  ActiveCopper^™
  
  Tunable copper sintering pastes, adhesives, and inks for die attach, micro-bumping, and via fill—delivering superior heat transfer.
- Affinity^™
  
  Affinity^™
  
  ENIG and ENEPIG final finishes for reliable wire bonding and superior solderability in advanced packaging designs.
- ALPHA^®
  
  ALPHA^®
  
  Advanced adhesion, flux, and soldering solutions for reliable electronic assemblies in lead-free and tin-lead technologies.
- Argomax^®
  
  Argomax^®
  
  Reliable sinter and die-attach solutions for EV and power electronics, meeting rigorous industry standards.
- ATROX^®
  
  ATROX^®
  
  High-performance conductive and non-conductive die-attach pastes and films for power semiconductors and discrete assemblies.
- Autostat^™
  
  Autostat^™
  
  A low shrink, heat stabilized polyester film with excellent ink adhesion, enabling reliable, high precision flexible circuits & sensors.
- Autotype^®
  
  Autotype^®
  
  Autotype® delivers premium hardcoated films and screen making products rooted in innovation, quality, and heritage.
- Blackhole^®
  
  Blackhole^®
  
  The efficient, reliable PCB metallization solution preferred by fabricators worldwide over electroless copper.
- Compugraphics^®
  
  Compugraphics^®
  
  Delivering reliable, high-precision photomask solutions that ensure quality, speed, and flexibility to meet your manufacturing needs.
- Eclipse^®
  
  Eclipse^®
  
  Easy-to-use, efficient PCB metallization that delivers high performance, reliability, and durability.
- Electrolube^®
  
  Electrolube^®
  
  Advanced conformal coatings, encapsulation resins, and thermal management solutions for reliable electronics manufacturing.
- Enklad
  
  Enklad
  
  Advanced cleaning, etching, and zincate processes for superior nickel coatings on aluminum memory disks.
- ENTEK^®
  
  ENTEK^®
  
  Trusted organic solderability preservatives, proven in production across diverse lead-free assembly applications.
- ENVISION^®
  
  ENVISION^®
  
  Polymer-based direct metallization for PCBs enhances board capacity and performance.
- Exactalloy^®
  
  Exactalloy^®
  
  Precision solder preforms ensure accurate volumes, improving reliability and efficiency in electronics assembly.
- HiFlo^®
  
  HiFlo^®
  
  Purest, high-fluidity solder made from virgin metals for unmatched performance and minimal dross.
- HiTech^®
  
  HiTech^®
  
  Drop Shock, Impact Bend, and ATC-tested adhesives, underfills, and encapsulants for soldered components.
- Innolot^®
  
  Innolot^®
  
  High-reliability, lead-free solder alloy for robust performance in harsh environments.
- Kester^®
  
  Kester^®
  
  Circuit board assembly materials including traditional soldering chemicals, paste, wire, and bar products.
- Kuprion^®
  
  Kuprion^®
  
  Engineered copper innovations for high-power electronics.
- M-Copper Omega^®
  
  M-Copper Omega^®
  
  Premium electroless copper for primary PCB metallization, ensuring high reliability.
- MacuSpec^™
  
  MacuSpec^™
  
  High-performance electrolytic copper processes for the plating of through holes and filling of micro vias.
- MICROFAB^®
  
  MICROFAB^®
  
  High-quality copper, gold, and solder for WLP, meeting demands of IDM, OSAT, and foundries.
- Micromax^™
  
  Micromax^™
  
  Micromax^tm Electronic Inks and Pastes are highly reliable thick film inks, pastes, ceramic tapes and printed electronic inks.
- MultiPrep
  
  MultiPrep
  
  Advanced copper treatment, promoting adhesion for innerlayer and soldermask applications.
- NOVAFAB^®
  
  NOVAFAB^®
  
  Advanced Cu, Ni, Pd, Ag, and Au solutions for WLP, meeting the demands of IDM, OSAT, and foundries.
- ORMECON^®
  
  ORMECON^®
  
  Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.
- PALLADEX^®
  
  PALLADEX^®
  
  Electrolytic palladium plating for reliable connectors and interconnects.
- PowerBond^®
  
  PowerBond^®
  
  High-strength solder with superior thermal fatigue, close to high-lead alloy performance.
- Reliance^®
  
  Reliance^®
  
  A unique, patent-pending reliability toolset integrating solder and polymer data insights for unmatched circuit board assembly perform
- Shadow^®
  
  Shadow^®
  
  Sustainable graphite-based direct metallization, a cleaner alternative to electroless copper.
- STAYDRY^®
  
  STAYDRY^®
  
  Advanced moisture, particle, and hydrogen getters designed to enhance performance and reliability across diverse applications.
- STAYSTIK^®
  
  STAYSTIK^®
  
  Versatile adhesives delivering reliable mechanical, electrical, and thermal bonding for both temporary and permanent applications.
- Sterling^®
  
  Sterling^®
  
  Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.
- Systek^™
  
  Systek^™
  
  Comprehensive IC substrate metallization processes for RDL, through-hole filling, and embedded traces.
- TensoRed^®
  
  TensoRed^®
  
  Reliable, cost-efficient stencil tensioning that ensures consistent performance without the need for air pressure.
- Tetrabond^®
  
  Tetrabond^®
  
  Innovative "frameless" stencils for safer, more secure mounting and demounting.
- TrueHeight^®
  
  TrueHeight^®
  
  Preforms that ensure consistent bondline thickness, reducing die tilt in assembly.
- Via Dep^®
  
  Via Dep^®
  
  Low-stress electroless copper for PTH and micro-via metallization, with reliable, horizontal processing.
- ViaForm^®
  
  ViaForm^®
  
  Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.
- XMAPP^™
  
  XMAPP^™
  
  Comprehensive guidance and expertise with XtraForm^® materials, process mapping, product design, and production processes.
- XtraForm^®
  
  XtraForm^®
  
  High-performance hardcoated, formable 3D films for durable, seamless integration of electronics in automotive surfaces.
Markets
- Automotive Electronics
  
  Electronics Solutions for Next-Generation Automotive Reliability
  
  High-performance materials engineered for reliability in extreme conditions. Our solutions connect, protect, interconnect, and reinforce circuitry in powertrain, in-cabin, lighting, and safety system automotive electronics assemblies.
- Computing
  
  Enhancing Production Yields While Reducing Total Cost of Ownership
  
  We engineer soldering materials, reinforcement polymers, and circuitry formation solutions to increase throughput, reduce costs, and deliver reliable connections across all types of computer-related assemblies.
- Consumer Electronics
  
  Boost Throughput with Low-Cost, Low-Temp Solder Solutions
  
  For consumer electronics PCB assembly and semiconductor manufacturing, our integrated products, expertise, and innovative processes enable designers to miniaturize components, enhance performance, and reduce the total cost of ownership.
- Industrial / HMI
  
  PCB Assembly Materials & Hardcoated Films for HMI Touchscreens
  
  In addition to providing connectivity and heat dissipation between components, our materials protect PCBs and enhance touchscreen strength. Our high-performance solder alloys also resist damp environments, all contributing to extended component life.
- Medical Solutions
  
  Improving Component Reliability and Manufacturing Efficiency
  
  We improve the reliability of medical components and assemblies while reducing costs and enhancing manufacturing efficiency. Our electronics solutions for the medical industry meet performance specifications and support device-level FDA approval.
- Military & Aerospace
  
  Performance and Reliability, Even in Demanding Environments
  
  Our circuitry formation, board, and semiconductor assembly products ensure reliability in electronic solutions for military and aerospace applications. Trusted by PCB fabricators, they deliver robust performance even in the harshest environments.
- Mobile Phone
  
  Integrated Solutions for Smartphone Design and Assembly
  
  Our electronic solutions for mobile phone assembly cover wafer-level packaging, circuit metallization, semiconductor, and board assembly, helping companies build the most complex components used in advanced smartphone devices today.
- Power Electronics
  
  Improving the Power, Range and Reliability of Power Electronics
  
  Sinter materials, high-reliability solder, reinforcement polymers, and thermal interface materials reduce thermal resistance, protect in harsh environments, and dissipate excess heat, significantly improving efficiency and performance.
- Renewable Energy
  
  Electronic Materials for Green Energy Electronic Solutions
  
  Our connecting and interconnecting materials enable green energy electronics, including module assemblies, microinverters, and PV ribbon and wire manufacturing, enhancing efficiency and performance, even in high-voltage applications.
- Telecommunications
  
  Flexible Hardware Design Options
  
  We engineer integrated solutions that offer high electrochemical reliability, excellent thermal and electrical conductivity, high throughput, and low defects—ensuring superior performance and efficiency in your telecommunications electronic service hardware.
Markets

We deliver unmatched reliability and performance across diverse electronic markets with integrated materials that connect, interconnect, reinforce, protect, manage heat, and enhance haptics and touch capabilities.
About Us
- Careers
  
  Come Join MacDermid Alpha!
  
  Join an organization with over 100 years of innovation and a culture built on character and collaboration. We have created a work environment where you can truly thrive.
- Search Jobs
About MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions, a business unit of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials, helping to deliver enhanced performance, reliability, and sustainability to electronics manufacturers worldwide.

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AccuFlux®

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ALPHA®

Argomax®

ATROX®

Autostat™

Autotype®

Blackhole®

Eclipse®

Electrolube®

Enklad

ENTEK®

ENVISION®

Exactalloy®

HiFlo®

HiTech®

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MacuSpec™

MICROFAB®

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NOVAFAB®

ORMECON®

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Shadow®

STAYDRY®

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Tetrabond®

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ViaForm®

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Acid Copper Technologies

Adhesives & Encapsulants

Adhesives - Camera Modules

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High-Throw DC

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Electrolube® FLU Fluxlene Flux Cleaning Solvent TDS

Electrolube® FLU Fluxlene Flux Cleaning Solvent Technical Data Sheet

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Electrolube® EAD Non-Flammable Air Duster TDS

Electrolube® EAD Non-Flammable Air Duster Technical Data Sheet

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Electrolube® EADP Non-Flammable Air Duster Plus TDS

Electrolube® EADP Non-Flammable Air Duster Plus Technical Data Sheet

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Electrolube® EWI IPA Electrowipes TDS

Electrolube® EWI IPA Electrowipes Technical Data Sheet

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Alpha® (Altoona) Public Due Diligence Report

Alpha® Public Due Diligence Report

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PC 600 Brochure - English

Pulse Plating Electrolytic Copper Metallization English Brochure

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Systek IC Substrates Brochure - English

Systek^TM Advanced Packaging Brochure - English

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Affinity Flex Brochure - Simplified Chinese

For ENIG and ENEPIG Applications - Affinity Flex Brochure - Simplified Chinese

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M-Speed HF Brochure - Simplified Chinese

M-Speed HF Brochure - Simplified Chinese

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PackageBond Brochure - Simplified Chinese

Adhesion Promotion for Lead Frame Based Packaging

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