15 results
ALPHA® Argomax® 2040 Paste
High-performance silver sintering paste engineered for top attach and die bonding applications.
Learn moreALPHA® Argomax® 5040 Paste
Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering.
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Nano-silver sintering paste for package attach applications requiring large-area, reliable bond lines.
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A silver sintering paste for die attachment, crafted for low-pressure sintering on copper-finished surfaces.
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Sintering paste for die attachment, ideal for high-volume, low-pressure use. Ensures uniform printing and long stencil life.
Learn moreALPHA® Argomax® 2040 Paste
A silver sintering die attach paste for placing dies on wet paste (before drying) and then performing low-pressure sintering.
Learn moreALPHA® Argomax® 2047 Paste
Nano-silver paste for large-area attachments (module to baseplate, heat sink) with a thick, reliable bond line.
Learn moreALPHA® Argomax® 5040 Paste
Sinter silver paste for die attachment on copper, designed for wet paste placement and low-pressure sintering.
Learn moreALPHA® Argomax® 8020 Film
Sinter silver film for die and spacer lamination on silver surfaces, using pick-and-place equipment.
Learn moreALPHA® Argomax® 8021 Film
Sinter silver film for die and spacer lamination on various surfaces with pick-and-place, no printing needed.
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