PC 610
Pulse plating process with excellent control of throwing power within through-holes, surface copper thickness and variation.
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Product Overview
PC 610 is an industry-leading pulse plating process designed to provide excellent throwing power within through-holes, surface copper thickness, and surface copper variation. The process enhances the reliability of planarization and etching processes. PC 610 can significantly reduce plating times while providing an excellent surface-to-hole plating thickness ratio.
Product Features
Superior Throwing Power
PC 610 offers excellent throwing power on through-holes with aspect ratios exceeding 30:1.
Excellent Surface Copper Thickness
Used for plating high aspect ratio through-holes and microvias by panel, pattern, and button plating.
Increased Reliability
Produces consistently excellent electrolytic copper deposits with high tensile strength and elongation over a long bath life.
High Volume Production, Lowest Cost of Ownership
With more control over surface copper, there are lower anode costs and reduced production costs in etching and post-plating processes.
High Degree of Uniformity
Conformally plates copper at the hole center with easy process controls.
Easy to Analyze
Easily analyzed by Cyclic Voltammetric Stripping (CVS) and controlled through auto-dosing, allowing for easy maintenance.
Applications
Servers, Mobile, and Automotive
The process is perfect for electronics where power, thermal management, and complexity are becoming increasingly challenging.
Product Documentation
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