Shadow® Plus
The latest graphite-based, wet-etch direct metallization technology designed to enhance reliability in high-density applications.
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Product Overview
Shadow Plus is a graphite-based, patented wet-etch direct metallization technology designed to provide enhanced reliability for high-density applications. It enables the plating of microvias and through holes using graphite-based colloids and proprietary additives to make the holes conductive. The technology is our most advanced alternative to electroless copper, delivering faster throughput and significant sustainability benefits.
Product Features
Enhanced Reliability and Performance
Shadow Plus enhances reliability through direct copper-to-copper bonding with fewer interfaces, eliminating nano-voiding.
Efficient, Stable Process with Reduced Sludging Compared to Other Direct Metallization Processes
Shadow Plus is an easy-to-control, 3-chemical step process that uses less power and operates at lower temperatures than electroless copper.
Proven Sustainability Benefits over Electroless Copper
The technology delivers a significant reduction in waste generation, water, power, and chemical consumption, while eliminating hazardous chemicals such as formaldehyde and Ethylenediaminetetraacetic Acid (EDTA). In addition, wet-etch technology allows for further reductions in water and power usage compared to older generation direct metallization processes.
Shadow Plus
Introducing Shadow Plus, a graphite-based, wet-etch direct metallization technology.
Reliability for Cutting-Edge Substrates
Shadow Plus enables fabricators to meet the Printed Circuit Board (PCB) industry’s demand for increased functionality and complex board designs. The technology delivers proven reliability through test methods such as Optical Microscopy Thermal Stress Test (OM), thermal cycle, and Interconnect Stress Test (IST) tests, allowing designers to integrate microvias and any-layer High-Density Interconnect (HDI) using high-performance and exotic materials. Utilizing wet-etch technology, the Shadow Plus process increases yields and throughput through faster diffusion.
Increased Process Efficiency
Shadow Plus is a more consistent process than electroless copper, utilizing fewer process and rinse steps, no requirement for feed-and-bleed, and lower operating temperatures. Compared to other direct metallization processes, Shadow Plus also provides greater process efficiency by further reducing the number of steps.
Meet EH&S Goals with Shadow Plus
Shadow Plus direct metallization technology delivers a significant reduction in waste generation, as well as in water, power, and chemical consumption, compared to electroless copper. With no formaldehyde, it is safer for operators and reduces maintenance requirements. These factors enable PCB manufacturers to meet sustainability goals while delivering significant operational savings.
Featured Applications
High-Density Designs
Shadow Plus is ideal for advanced substrates with high aspect ratios, blind, buried, and stacked vias, tight lines and spaces, and more.
PCB Applications
Shadow Plus can be used in a wide variety of PCB applications across the automotive, mobile device, telecom, server, and military/aerospace markets.