ALPHA® Argomax® AccuLam™ 8022 Film
High-reliability silver sinter pre-cut film with a pure silver bond line, offering excellent thermal/electrical conductivity on Ag/Au.
Contact UsProduct Overview
Argomax® AccuLam™ is ideal for spacer attach applications lacking flat, sharp edges required for standard Die Transfer Film (DTF) processes. It offers typical Argomax reliability while enabling lower temperature and pressure lamination, which results in faster processing and accommodates larger DTF component sizes. This product is compatible with leading bonders for die attach film and supports both spacers and dies.
Product Features
Spacer Attach Application
Designed for spacer attach applications where flat, sharp edges are not available, making it versatile for various assembly processes.
Typical Argomax Reliability
Maintains the proven reliability of Argomax products, ensuring consistent performance that meets customer requirements.
Lower Temperature and Pressure Lamination
Enables lamination at lower temperatures and pressures, resulting in faster processing times and efficiency improvements.
Processing Temperature (190 – 300°C)
This temperature range allows for effective sintering of the film while minimizing thermal stress on sensitive semiconductor components. The low-pressure processing reduces the risk of damaging delicate materials, ensuring reliable assembly and longevity of electronic devices.
Melting Point (962°C)
After processing, Argomax maintains a melting point of 962°C, providing excellent thermal stability for semiconductor applications. This high melting point ensures that the bond remains intact during high-temperature operations, enhancing device reliability.
Density (~85%)
A density of approximately 85% contributes to the film's structural integrity, providing a robust bond line. This characteristic helps maintain a solid connection between components, which is critical for performance and durability.
Thermal Conductivity (200 – 300 W/mK)
With high thermal conductivity, Argomax effectively dissipates heat generated during operation, preventing thermal failure in semiconductors. This property supports the overall efficiency and performance of high-power electronic devices.
Electrical Resistivity (2.5 - 3.5 µΩcm)
The low electrical resistivity of Argomax ensures minimal electrical losses in the connection, enhancing semiconductor device efficiency. This characteristic is crucial for maintaining performance in high-frequency applications.
Featured Applications
Power Electronics
Used in electric vehicle powertrains, particularly in inverter die-attach, where efficient thermal management and reliability are crucial.
Renewable Energy
Employed in high-power components of renewable energy systems, helping to dissipate heat and extend component life.
High-Power LEDs
Supports the thermal and electrical requirements of high-power Light-Emitting Diode (LED) modules, ensuring long-term stability and performance under high-power operation.