ALPHA® HiTech® CF31-4026 Edgebond

Next-generation, high reliability, reworkable edgebond.

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Product Overview

ALPHA HiTech CF31-4026 is a reworkable edgebond with high Glass Transition Temperature (Tg) and low Coefficient of Thermal Expansion (CTE), purposefully engineered for high-temperature automotive applications that require exceptional board-level reliability. With superior thermal cycling performance and reworkability at temperatures as low as 185°C, this advanced edgebond offers improved process yields to help reach sustainability objectives.​

Versatile in its applications, CF31-4026 extends its robust reinforcement to high reliability markets such as high-performance computing. This edgebond reinforces the Ball Grid Array (BGA) while avoiding contact with solder interconnects beneath the component. Its fluorescent appearance aids in efficient and accurate visual inspection. For industries that require both high temperature resilience and component reinforcement for extended operational life, ALPHA HiTech CF31-4026 is the optimal solution.

Product Features

TBD CBA-Product Features
High Glass Tg

Ideal for automotive and other high-temperature applications.

Low α1

Enabling excellent Thermal Cycling Test (TCT) performance for board-level reliability.

Reworkable Edgebond

Removable at 185-200°C for high-yield manufacturing and lower total cost of ownership (TCO).

Superior Slump Performance

Prevents material from spreading to solder interconnects beneath components, maintaining integrity and reliability in high-density Printed Circuit Boards (PCBs).

Fluorescent Appearance

Enabling visual detection under Ultraviolet (UV) light.