| MacDermid Alpha

Circuit Board Protection

Safeguard electronics with advanced potting compounds and conformal coatings, ensuring durability in any environment.

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Contact Lubricants

Prolong component life, reduce wear and hot spots with proven contact lubricants, boosting electrical efficiency.

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Electronic, General Purpose Cleaning

Deliver contaminant-free components with single-stage cleaning solutions, optimizing operation and high-performance.

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Polymer Reinforcement

Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.

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Solder Recycling

Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.

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Surface Mount Technology

Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.

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Thermal Management

Enhance device performance and longevity with high-performance materials that efficiently dissipate heat.

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Through Hole Assembly

Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.

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Pioneering Solutions for Optimal PCB Assembly Performance

We provide next-generation material solutions that enhance performance in demanding applications, enabling advanced technology, supporting high reliability, and optimizing throughput and yields for greater efficiency and value.

Circuit Formation

Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-gen applications.

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Connector Plating

Ensure durability and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.

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Electrolytic Copper Metallization

Maximize precision in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.

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IC Substrates

Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.

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Memory Disk

Lay the foundation for reliable performance in complex designs with our engineered primary metallization systems.

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PCB Surface Finishes

Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.

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Primary Metallization

Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.

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High Performance Printed Circuit Board (PCB) Materials

Our chemistries are designed to meet reliability and performance goals, addressing industry challenges for today’s electronic devices. We deliver innovative, sustainable solutions to a diverse range of markets in the rapidly evolving electronics industry.

Circuit Materials

High-performance materials designed for flexible, formable, and reliable circuits in innovative electronics applications.

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First Surface Hardcoated Films for Smart Interfaces

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Screen Printing Materials

Optimize stencil life and simplify prep with high-quality films, emulsions, and chemicals for superior print results every time.

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A Unique Portfolio of Materials and Expertise for Smart Surfaces

From simple labels to sophisticated automotive smart surfaces and displays, our flexible films, formable films, and circuit inks enable efficient design and high-yield production of durable, attractive Human Machine Interfaces (HMIs).

Advanced Interconnect Assembly

Enhance thermal efficiency and precision with our solder TIM, solder, and flux solutions for advanced chip fabrication.

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Camera Modules

Camera module adhesives for secure assembly and peak performance.

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Microelectronics and Sensors

Optimize electronics performance with getters and marking inks for superior bonding and chemical resistance improving device lifespan.

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Photomasks

Maximize yield and reduce cost of ownership with reliable Compugraphics photomasks delivered with fast cycle times.

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Power Electronics

Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.

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Standard Die Attach

Attain high-precision, reliable bonding with our die attach solutions for advanced semiconductor assembly.

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Engineered Thermal Management Solutions

Top-side, die attach, and package attach for power electronics. High-, mid-, low-thermal, non-conductive die attach materials, flip chip & BGA fluxes, fine-feature solder paste, and sTIM.

Advanced Interconnect Metallization

Transform package performance with advanced interconnect solutions, delivering reliable, uniform, and robust results.

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Compound Semiconductor Fabrication

Enhance reliability and performance in compound semiconductor fabrication with industry-leading precious metal plating technologies.

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Advanced Packaging Solutions

Our materials maximize semiconductor performance and reliability for next-generation technologies. With an agile and flexible development process, we deliver unique solutions that provide the lowest cost of ownership and the fastest time to market.

Our Interconnect Solutions

Our metallization and wafer level packaging technologies enable complex, high-density interconnect designs. We provide advanced solutions for direct metallization of printed circuit boards, semi-additive copper metallization on IC substrates, and copper plating for TSV interconnects.

When applied in wafer-level packaging, PCB fabrication, and semiconductor assembly, our solutions deliver seamless electrical performance and long-term reliability, reinforcing our commitment to innovation and excellence in connectivity.

Our Connect Solutions

We enable reliable circuit pathways that enhance connectivity in high-density designs. Our board-level assembly, circuit fabrication, standard die attach, top-side attach, and package attach solutions create strong, durable bonds with excellent electrical and thermal conductivity for advanced performance.

Our Reinforce Solutions

Our precision bonding technologies reinforce critical components with advanced mechanical and adhesive properties, ensuring reliability and optimal performance in next-generation electronics, even in the harshest of environments.

Our Protect Solutions

Formulated to withstand physical shock, vibration, corrosion, and thermal stress, our protective solutions extend component lifespan and reduce risk of failure.

When used in circuit board assembly, our technologies deliver durable protection and consistent performance, reinforcing our commitment to enhanced device reliability.

Our Thermal Management Solutions

We offer a wide range of thermal interface material (TIM) solutions for circuit board and semiconductor assembly in high-powered electronics, delivering superior thermal performance without compromising device miniaturization or system complexity.

Our combined solutions ensure optimal thermal regulation, reinforcing our expertise in maintaining device efficiency and reliability.

Our Haptic & Touch Solutions

Our formable and flexible films, combined with advanced circuit materials, enable innovative designs and high-yield production of durable, visually striking Human Machine Interfaces (HMIs).

We create immersive, responsive user experiences that reinforce our leadership in advanced haptic solutions for next-generation devices.

AccuFlux^®

Precision micro-flux coatings reduce voids, enhance joint integrity, and set new standards for soldering performance.

ActiveCopper^™

Tunable copper sintering pastes, adhesives, and inks for die attach, micro-bumping, and via fill—delivering superior heat transfer.

Affinity^™

ENIG and ENEPIG final finishes for reliable wire bonding and superior solderability in advanced packaging designs.

ALPHA^®

Advanced adhesion, flux, and soldering solutions for reliable electronic assemblies in lead-free and tin-lead technologies.

Argomax^®

Reliable sinter and die-attach solutions for EV and power electronics, meeting rigorous industry standards.

ATROX^®

High-performance conductive and non-conductive die-attach pastes and films for power semiconductors and discrete assemblies.

Autostat^™

A low shrink, heat stabilized polyester film with excellent ink adhesion, enabling reliable, high precision flexible circuits & sensors.

Autotype^®

Autotype® delivers premium hardcoated films and screen making products rooted in innovation, quality, and heritage.

Blackhole^®

The efficient, reliable PCB metallization solution preferred by fabricators worldwide over electroless copper.

Compugraphics^®

Delivering reliable, high-precision photomask solutions that ensure quality, speed, and flexibility to meet your manufacturing needs.

Eclipse^®

Easy-to-use, efficient PCB metallization that delivers high performance, reliability, and durability.

Electrolube^®

Advanced conformal coatings, encapsulation resins, and thermal management solutions for reliable electronics manufacturing.

Enklad

Advanced cleaning, etching, and zincate processes for superior nickel coatings on aluminum memory disks.

ENTEK^®

Trusted organic solderability preservatives, proven in production across diverse lead-free assembly applications.

ENVISION^®

Polymer-based direct metallization for PCBs enhances board capacity and performance.

Exactalloy^®

Precision solder preforms ensure accurate volumes, improving reliability and efficiency in electronics assembly.

HiFlo^®

Purest, high-fluidity solder made from virgin metals for unmatched performance and minimal dross.

HiTech^®

Drop Shock, Impact Bend, and ATC-tested adhesives, underfills, and encapsulants for soldered components.

Innolot^®

High-reliability, lead-free solder alloy for robust performance in harsh environments.

Kester^®

Circuit board assembly materials including traditional soldering chemicals, paste, wire, and bar products.

Kuprion^®

Engineered copper innovations for high-power electronics.

M-Copper Omega^®

Premium electroless copper for primary PCB metallization, ensuring high reliability.

MacuSpec^™

High-performance electrolytic copper processes for the plating of through holes and filling of micro vias.

MICROFAB^®

High-quality copper, gold, and solder for WLP, meeting demands of IDM, OSAT, and foundries.

Micromax^™

Micromax^tm Electronic Inks and Pastes are highly reliable thick film inks, pastes, ceramic tapes and printed electronic inks.

MultiPrep

Advanced copper treatment, promoting adhesion for innerlayer and soldermask applications.

NOVAFAB^®

Advanced Cu, Ni, Pd, Ag, and Au solutions for WLP, meeting the demands of IDM, OSAT, and foundries.

ORMECON^®

Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.

PALLADEX^®

Electrolytic palladium plating for reliable connectors and interconnects.

PowerBond^®

High-strength solder with superior thermal fatigue, close to high-lead alloy performance.

Reliance^®

A unique, patent-pending reliability toolset integrating solder and polymer data insights for unmatched circuit board assembly perform

Shadow^®

Sustainable graphite-based direct metallization, a cleaner alternative to electroless copper.

STAYDRY^®

Advanced moisture, particle, and hydrogen getters designed to enhance performance and reliability across diverse applications.

STAYSTIK^®

Versatile adhesives delivering reliable mechanical, electrical, and thermal bonding for both temporary and permanent applications.

Sterling^®

Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.

Systek^™

Comprehensive IC substrate metallization processes for RDL, through-hole filling, and embedded traces.

TensoRed^®

Reliable, cost-efficient stencil tensioning that ensures consistent performance without the need for air pressure.

Tetrabond^®

Innovative "frameless" stencils for safer, more secure mounting and demounting.

TrueHeight^®

Preforms that ensure consistent bondline thickness, reducing die tilt in assembly.

Via Dep^®

Low-stress electroless copper for PTH and micro-via metallization, with reliable, horizontal processing.

ViaForm^®

Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.

XMAPP^™

Comprehensive guidance and expertise with XtraForm^® materials, process mapping, product design, and production processes.

XtraForm^®

High-performance hardcoated, formable 3D films for durable, seamless integration of electronics in automotive surfaces.

Electronics Solutions for Next-Generation Automotive Reliability

High-performance materials engineered for reliability in extreme conditions. Our solutions connect, protect, interconnect, and reinforce circuitry in powertrain, in-cabin, lighting, and safety system automotive electronics assemblies.

Enhancing Production Yields While Reducing Total Cost of Ownership

We engineer soldering materials, reinforcement polymers, and circuitry formation solutions to increase throughput, reduce costs, and deliver reliable connections across all types of computer-related assemblies.

Boost Throughput with Low-Cost, Low-Temp Solder Solutions

For consumer electronics PCB assembly and semiconductor manufacturing, our integrated products, expertise, and innovative processes enable designers to miniaturize components, enhance performance, and reduce the total cost of ownership.

PCB Assembly Materials & Hardcoated Films for HMI Touchscreens

In addition to providing connectivity and heat dissipation between components, our materials protect PCBs and enhance touchscreen strength. Our high-performance solder alloys also resist damp environments, all contributing to extended component life.

Improving Component Reliability and Manufacturing Efficiency

We improve the reliability of medical components and assemblies while reducing costs and enhancing manufacturing efficiency. Our electronics solutions for the medical industry meet performance specifications and support device-level FDA approval.

Performance and Reliability, Even in Demanding Environments

Our circuitry formation, board, and semiconductor assembly products ensure reliability in electronic solutions for military and aerospace applications. Trusted by PCB fabricators, they deliver robust performance even in the harshest environments.

Integrated Solutions for Smartphone Design and Assembly

Our electronic solutions for mobile phone assembly cover wafer-level packaging, circuit metallization, semiconductor, and board assembly, helping companies build the most complex components used in advanced smartphone devices today.

Improving the Power, Range and Reliability of Power Electronics

Sinter materials, high-reliability solder, reinforcement polymers, and thermal interface materials reduce thermal resistance, protect in harsh environments, and dissipate excess heat, significantly improving efficiency and performance.

Electronic Materials for Green Energy Electronic Solutions

Our connecting and interconnecting materials enable green energy electronics, including module assemblies, microinverters, and PV ribbon and wire manufacturing, enhancing efficiency and performance, even in high-voltage applications.

Flexible Hardware Design Options

We engineer integrated solutions that offer high electrochemical reliability, excellent thermal and electrical conductivity, high throughput, and low defects—ensuring superior performance and efficiency in your telecommunications electronic service hardware.

Come Join MacDermid Alpha!

Join an organization with over 100 years of innovation and a culture built on character and collaboration. We have created a work environment where you can truly thrive.

Circuit Board Protection

Contact Lubricants

Electronic, General Purpose Cleaning

Polymer Reinforcement

Solder Recycling

Surface Mount Technology

Thermal Management

Through Hole Assembly

Pioneering Solutions for Optimal PCB Assembly Performance

Circuit Formation

Connector Plating

Electrolytic Copper Metallization

IC Substrates

Memory Disk

PCB Surface Finishes

Primary Metallization

High Performance Printed Circuit Board (PCB) Materials

Circuit Materials

First Surface Hardcoated Films for Smart Interfaces

Screen Printing Materials

A Unique Portfolio of Materials and Expertise for Smart Surfaces

Advanced Interconnect Assembly

Camera Modules

Microelectronics and Sensors

Photomasks

Power Electronics

Standard Die Attach

Engineered Thermal Management Solutions

Advanced Interconnect Metallization

Compound Semiconductor Fabrication

Advanced Packaging Solutions

Boosting PCB, IC substrate, semiconductor & display performance.

Our Interconnect Solutions

Our Connect Solutions

Our Reinforce Solutions

Our Protect Solutions

Our Thermal Management Solutions

Our Haptic & Touch Solutions

Solutions at Every Step

AccuFlux®

ActiveCopper™

Affinity™

ALPHA®

Argomax®

ATROX®

Autostat™

Autotype®

Blackhole®

Compugraphics®

Eclipse®

Electrolube®

Enklad

ENTEK®

ENVISION®

Exactalloy®

HiFlo®

HiTech®

Innolot®

Kester®

Kuprion®

M-Copper Omega®

MacuSpec™

MICROFAB®

Micromax™

MultiPrep

NOVAFAB®

ORMECON®

PALLADEX®

PowerBond®

Reliance®

Shadow®

STAYDRY®

STAYSTIK®

Sterling®

Systek™

TensoRed®

Tetrabond®

TrueHeight®

Via Dep®

ViaForm®

AccuFlux^®

ActiveCopper^™

Affinity^™

ALPHA^®

Argomax^®

ATROX^®

Autostat^™

Autotype^®

Blackhole^®

Compugraphics^®

Eclipse^®

Electrolube^®

ENTEK^®

ENVISION^®

Exactalloy^®

HiFlo^®

HiTech^®

Innolot^®

Kester^®

Kuprion^®

M-Copper Omega^®

MacuSpec^™

MICROFAB^®

Micromax^™

NOVAFAB^®

ORMECON^®

PALLADEX^®

PowerBond^®

Reliance^®

Shadow^®

STAYDRY^®

STAYSTIK^®

Sterling^®

Systek^™

TensoRed^®

Tetrabond^®

TrueHeight^®

Via Dep^®

ViaForm^®

XMAPP^™

XtraForm^®