Kester® Indium sTIM
Solder TIM offers a non-adhesive, non-organic link between the die and heat spreader, ensuring even thermal dissipation.
Contact UsProduct Overview
As semiconductor packages increase in performance and functionality, the demand for advanced Thermal Interface Materials (TIMs) rises. With decreasing junction resistance, traditional organic-based TIMs are approaching their limits for high-performance power applications. Kester's indium-based solder TIMs offer superior thermal conductivity, providing the next step in TIM interconnect solutions.
Product Features
High-Purity Materials
High-purity materials ensure reliable performance and high thermal conductivity.
Mechanical Strength
Excellent mechanical strength and wetting properties on various metallizations, such as Ag and Au.
Wide Processing Window
Compatible with multiple reflow profiles, providing flexibility in manufacturing processes.
Thermal Conductivity
High thermal conductivity ensures efficient heat dissipation from the die to the heat spreader, preventing overheating and enhancing the device's reliability.
Mechanical Strength
Excellent mechanical strength provides robust and reliable connections, reducing the risk of mechanical failure during thermal cycling and operation.
Wetting Properties
Superior wetting to various metallizations (e.g., Ag, Au) ensures strong and consistent solder joints, which are crucial for maintaining electrical and thermal performance.
Processing Window
An extremely wide processing window allows compatibility with multiple reflow profiles, offering flexibility in manufacturing processes and ensuring good solderability.
Minimize Voiding
Low voiding performance, achieved through unique flux chemistries, improves final yields and reliability by minimizing voids that could compromise thermal and mechanical integrity.
Featured Applications
Die Attach
Provides a reliable thermal interface between the die and heat spreader.
Power Devices
Suitable for high-performance power applications where traditional organic-based TIMs are insufficient.
Interconnects
Ideal for applications requiring precise thermal management and high mechanical strength.