ALPHA® WS-698 Flux
Water-soluble, high-activity paste flux that offers excellent wetting on tough finishes and low voiding performance.
Contact UsProduct Overview
ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Copper (ENIG) pad finishes. ALPHA WS-698 is a halogen-free, compliant material with high fluxing activity, delivering performance advantages in wetting, spread, and missing ball rate/yield.
Product Features
Excellent Soldering
Excellent activity enables strong soldering to ENIG and Cu OSP finishes.
Wetting Performance
Superior wetting maximizes assembly yields, providing the highest ball attach and flip chip yield rates.
Cleaning Strength
Excellent cleanability, with residues easily removed using deionized water.
Robust Solutions for High Soldering Yields
Suitable for soldering various lead-free and tin-lead eutectic alloys onto area array packages.
Superior Stability
Excellent material stability, with the flux maintaining tack and viscosity over multiple print cycles without replenishment for up to 8 hours.
Featured Applications
Pin Transfer
Precision Application: The flux’s high activity and stable viscosity ensure precise, consistent application, crucial for accurate pin transfer.
Flip Chip / Ball Dip
Material Stability: Maintains tack and viscosity across multiple print cycles, ensuring consistent performance without frequent replenishment.
Printing
Using ALPHA® WS-698 Flux in printing applications ensures high-quality, reliable solder joints, which are vital for semiconductor performance and longevity.