Affinity™ ENEPIG
Simple-to-operate process providing uniform nickel, palladium, and gold deposits with high reliability at the lowest cost of ownership.
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Product Overview
The Affinity Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) process is easy to operate, providing uniform nickel, palladium, and gold deposits with high reliability for soldering and wire bonding applications at the lowest cost of ownership. The proprietary nickel, palladium, and gold baths offer chemical stability during intermittent operation without wasteful plating on equipment.
Product Features
Superior Wire Bond Performance and Solderability
The nickel and palladium deposits are consistently uniform and, when paired with hybrid gold deposition, deliver a corrosion-free, highly solderable, and wire-bondable surface.
Corrosion Free Deposition
Affinity ENEPIG creates a corrosion-free surface, enhancing product reliability.
Significant Cost of Ownership Improvement
Cost improvements through extremely stable bath chemistry, simplified bath control, elimination of dummy plating, and reduced chemical waste and maintenance.
Corrosion Observations Reduced to Zero
Hybrid gold deposition improves gold thickness capability without relying solely on galvanic displacement of the Electroless Nickel (EN) deposit. The resulting Affinity ENEPIG surface is corrosion free, eliminating reliability concerns associated with traditional systems.
Wire Bonding Performance
Affinity ENEPIG eliminates corrosion, delivering a high-quality finish and ensuring the highest reliability for soldering and wire bonding performance, even after prolonged shelf life. Wire bonding performance remains stable throughout bath life and does not degrade after multiple assembly reflow thermal exposures.
Excellent Ball Shear Solderability Performance
The highly solderable nickel-palladium-gold coating of Affinity ENEPIG provides consistent ball shear performance throughout long chemical bath life and multiple reflow operations. The process delivers excellent solderability while adhering to Institute of Printed Circuit Boards (IPC) thickness specifications, including 4556 and the upcoming 4556A.
Featured Applications
Integrated Circuit (IC) Substrates
Affinity ENEPIG is designed for critical applications where six-sigma assembly performance and mission-critical reliability are required.