MultiPrep 200
Adhesion promoter that enables superior bonding for solder mask, dry film, and liquid photoresist on copper.
Contact UsProduct Overview
The MultiPrep 200 adhesion promoter process creates an ideal surface for the adhesion of soldermask, dry film, and liquid photoresist on copper. MultiPrep 200 eliminates the need for pumice and brush scrubbing, providing a uniform copper surface topography for unsurpassed bonding consistency.
Product Features
Micro-Roughened Surface
The process delivers a micro-roughened surface that is ideal for solder mask adhesion to microvias and ultra-fine features, while also creating a strong, reliable bond between via fill and Plated Through Hole (PTH) copper.
Optimized Copper Surface Roughening
The enhanced bond between the soldermask coating and copper prevents adhesion loss during subsequent processes, such as immersion tin plating, Hot Air Solder Levelling (HASL), and final assembly.
Excellent Compatibility
MultiPrep 200 is compatible with all final finish chemistries, including Electroless Nickel/Immersion Gold (ENIG), silver, Organic Solderability Preservative (OSP), and immersion tin.
Superior Soldermask and Photoresist Adhesion
MultiPrep 200 is the result of decades of experience with etching copper to optimize compatibility with our many other processes. When you use MultiPrep 200, you can be assured that our processes will perform reliably and durably, resulting in approval at all levels of the supply chain.
Customized Micro Roughening Process
The MultiPrep 200 process eliminates the inherent issues associated with other pre-treatment processes, such as pumice scrubbing and jet scrubbing. It delivers a rough, microetched surface that is ideal for microvias and ultra-fine structures on complex circuit boards. MultiPrep 200 is compatible with all surface finishes, providing ultimate uniformity and clean, continuous cosmetics.
Soldermask, Dry Film, and Liquid Photoresist
Unparalleled copper adhesion to soldermask, dry film, and liquid photoresist.
Product Documentation
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