PackageBond
Advanced leadframe adhesion technology designed to overcome delamination problems to achieve MSL-1 reliability.
Contact UsProduct Overview
PackageBond is the no-risk adhesion promotion system specifically engineered for optimal adhesion at today’s intense lead-free circuit assembly temperatures. Production-proven in high volume at premier semiconductor manufacturing facilities, our advanced laboratory innovations deliver extreme heat tolerance to leadframe packages.
Product Features
Proven Reliability at MSL-1 Without Delamination
PackageBond features patented chemistries that prevent delamination failures of molded packages due to moisture and reflow sensitivity.
Improved Adhesion Performance in Modern Chip Packages
The PackageBond process roughens copper alloy leadframes to maximize resin and encapsulation adhesion and deposits a thin adhesion booster for long-term delamination protection.
No Risk of Damage to Leadframe Platings
PackageBond does not degrade Ag or Ni/Pd/Au plated features and is compatible with wire bond, flip chip, and copper clip attach technologies.
Precision Bonding – Guaranteed Service and Support
PackageBond is an advanced leadframe adhesion technology designed to overcome moisture-related delamination problems and achieve MSL-1 reliability. The result of rigorous testing and consistent in-market success, PackageBond is the optimal choice for high-density, complex packages and can be run in either conveyorized or batch mode. We are committed to satisfying the evolving needs of the semiconductor industry while continuing our tradition of providing benchmark customer and technical support.
Wirebond, Flip Chip, and Copper Clip Die Attach Technologies
Production results confirm consistent compatibility with die attach adhesives and no adverse effects on resin bleed.
