M-Speed HF
Low-etch alternative oxide provides low surface profiles and reliable adhesion for high frequency applications.
Contact UsProduct Overview
M-Speed HF is a low-etch oxide alternative that improves signal integrity for high-speed innerlayers. The unique low-etch process provides a low-profile surface topography to optimize signal integrity and uniform trace geometry for controlled impedance designs. This process creates a low copper roughness profile combined with a silane post-dip, enabling a low-loss, high-reliability combination of mechanical and chemical bonding.
Product Features
Exceptional Surface Topography
Excellent surface topography on all three exposed sides of the copper trace ensures electrical properties meet the needs of high-frequency designs.
Excellent Adhesion and Thermal Resistance
Enabled by a combination of mechanical and chemical bonding, despite lower peak-to-valley roughness on the copper surface, making it superior for fine traces.
Superior Innerlayer Bonding
The surface created by M-Speed HF provides unparalleled bonding to a wide variety of resin systems and dielectric films on innerlayers.
Industry-Leading Performance
The M-Speed HF system achieves industry-leading performance by utilizing standard alternative oxide process equipment combined with a novel post-dip process. It is compatible with virtually all laminate materials and creates exceptional adhesion to low- and ultra-low-loss dielectric systems.
Featured Applications
High-Speed, Low Loss
Reduced copper roughness leads to lower signal attenuation and superior reliability for high-layer-count designs.