Electrolube® HTC Non-Silicone Thermal Interface Material
Heat transfer compound for efficient and reliable thermal coupling of electrical and electronic components.
Contact UsProduct Overview
HTC Heat Transfer Compound is a non-silicone thermal interface material recommended for efficient and reliable thermal coupling of electrical and electronic components, or between any surfaces where thermal conductivity or heat dissipation is important. It is ideal for application on the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers, semiconductors, thermostats, power resistors, and radiators.
As with all thermal interface materials, we strongly recommend stringent testing before selecting a material for your application. For further information, please refer to the product Technical Data Sheet (TDS) or contact our Technical Support Team, who are always available to provide solutions.
Product Features
Excellent Non-Creep Characteristics
Very High Thermal Conductivity: 0.9 W/m.K
Wide Operating Temperature -50°C to +130°C
Low Evaporation Weight Loss
Low Toxicity
HTC Non-Silicone Thermal Interface Material
Electrolube Heat Transfer Compound is recommended for efficient and reliable thermal coupling of electrical and electronic components.
It is available in various package sizes, including syringes, cartridges, and bulk formats.
