AccuFlux® Preforms: ALPHA® AccuFlux® BTC-578
Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.
Contact UsProduct Overview
ALPHA AccuFlux BTC-578 technology features a precision-controlled micro-flux coating on solder preforms. The chemistry is specifically designed to reduce voiding at the thermal/ground interface of Bottom Terminated Component (BTC) packages, such as Quad-Flat No-Leads (QFN), Quad Flat Package (QFP), and D-Pak.
By incorporating ALPHA AccuFlux BTC-578 flux-coated preforms and solder paste with an optimized stencil design, minimal to non-detectable flux residues are achieved, meeting the most demanding electrochemical reliability requirements. This technology can easily be integrated into existing Surface Mount Technology (SMT) circuit assembly processes.
Product Features
Efficient Heat Dissipation through Consistently Low Voids
Enhanced Process Stability and Predictable Reliability
Enhanced process stability and predictable reliability are achieved through repeatable void distribution.
Maximizes Mechanical Integrity Through Increased Solder Volume
Enhanced Electrochemical Reliability
Enhanced electrochemical reliability on shrinking component packages through low flux residue.
Tackles the Most Challenging Void Performance
As power requirements for BTCs increase, component manufacturers are designing smaller device packages that require minimal voids for optimal performance. Achieving consistent void results can be challenging, not only from board to board but also from component to component.
OEMs often require 100% X-ray inspection to manage random void performance under BTCs, leading to countless hours of rework and higher costs. ALPHA AccuFlux BTC-578 preforms provide a proven solution for delivering consistent, low void results with very high confidence.
BTC-578 Solder Preform Sizing Chart
Sizes are available to support the most common bottom-terminated component packages.
Increase Solder Volume
Solder preforms can be used on a mixed SMT and through-hole Printed Circuit Board (PCB) to increase the solder volume of both SMT and through-hole components.
