Electrolube® UVFlex™
High-reliability, solvent-free protection combining efficient UV cure with exceptional thermal cycling and SIR performance.
Contact UsProduct Overview
Electrolube® UVFlex™ is a next-generation, solvent-free, UV-curable conformal coating engineered for demanding electronics applications. Its unique elasticity helps maintain coating integrity through extreme thermal cycling and harsh environmental conditions, delivering outstanding protection for electronic assemblies.
The advanced coating technology provides significantly higher surface insulation resistance (SIR) and enhanced compatibility with leading no-clean solder pastes compared with conventional UV-curable coatings, helping maintain reliable protection throughout product operation in the field.
Designed to protect against condensation and corrosive atmospheres, the coating chemistry combines superior performance with improved sustainability. Containing 25–30% bio-based content, UVFlex offers a more sustainable solution without compromise, extending the service life and reliability of electronic circuit boards operating in the most demanding environments.
Product Features
Solvent-Free, Fast-Cure Processing
Urethane acrylate chemistry with UV cure in seconds and secondary moisture cure (RTV) for shadowed areas. ~100% solids formulation that is solvent-free, silicone-free, and PFAS-free.
Exceptional Thermal Cycling Performance
Long-lasting high elongation and elasticity help maintain coating integrity through thermal shock and extreme thermal cycling. Low modulus below -40°C and high-temperature stability help maintain protection across a wide operating temperature range of -65°C to +150°C.
Enhanced Edge Coverage
Thixotropic formulation improves component and edge coverage, as well as high surface insulation resistance (SIR) in damp heat (85°C/85% RH >10 GΩ) and condensation environments.
Supports Long-Term System Reliability
Improved compatibility with no-clean solder paste helps support overall system reliability throughout product operation.
Sustainable by Design
Increased protection helps extend product lifetimes, while 25–30% bio-based content contributes to a more sustainable solution.
Flame-Retardant Protection
Designed to meet UL 94 V-0 requirements (approval pending).
Outstanding Thermal Cycling Capability
UVFlex provides long-lasting thermal cycling resistance beyond currently available UV-curable conformal coatings. Tested on no-clean solder paste assemblies through up to 1,000 thermal cycles from -40°C to +125°C, it supports the reliability requirements of automotive and other demanding electronics applications.
Enhanced Component Coverage and Protection
Improved thixotropic properties enable enhanced component coverage, helping protect electronic assemblies operating in damp heat, condensation and corrosive environments.
Optimized for No-Clean Assemblies
UVFlex has been developed with improved compatibility for no-clean solder pastes, including ALPHA® CVP-390V, OM-353, and OM-340, supporting increased system-level reliability in harsh operating environments.
Responsible Chemistry
Fast UV curing helps reduce energy consumption during production compared with heat-cure technologies. UVFlex also features PFAS-free chemistry that is free of solvents and silicones, containing 25–30% bio-based content derived from renewable sources, helping reduce reliance on non-renewable raw materials.
