Driving PCB technology with leading-edge electronic materials for high-reliability in complex Circuit Board Assemblies (CBAs).
Safeguard electronics with advanced potting compounds and conformal coatings, ensuring durability in any environment.
Protect your PCBAs with conformal coatings for enhanced durability and reliability in demanding environments.
Protect PCBAs with potting compounds and resins that form a complete barrier, ensuring superior performance in harsh environments
Prolong component life, reduce wear and hot spots with proven contact lubricants, boosting electrical efficiency.
Deliver contaminant-free components with single-stage cleaning solutions, optimizing operation and high-performance.
Reinforce electrical components with high-performance adhesives, underfills and edgebonds, supporting a wide range of applications.
Achieve strong reinforcement for electrical components in diverse applications with our high-performance adhesives and encapsulants.
Improve reliability and boost manufacturing efficiency with heat-curable epoxies to reinforce advanced BGA packages.
Enhance reliability in complex semiconductor packages with heat-curable reinforced epoxies designed for capillary underfill.
Achieve maximum returns and compliance with certified, traceable solder recycling, providing reliable waste management.
Enable complex board designs with reliable Surface Mount Technology (SMT) solder solutions, optimizing electronics assembly processes.
Ensure robust performance in critical assemblies with high-reliability cored solder wire designed for primary attach and rework.
Achieve consistent, reliable cleaning results with solutions designed for a variety of assembly applications.
Enable reliable electronics packaging with precision preforms delivering volume control, reliability, and performance.
Meet demands for miniaturization, reliability, and yield with advanced solutions providing a wide processing window to lower TCO.
Optimize assembly with solutions addressing today’s printing needs through rapid response, high accuracy, and exceptional performance.
Enhance device performance and longevity with high-performance materials that efficiently dissipate heat.
Advanced thermal management solutions that deliver efficient heat dissipation and long-term system reliability.
Address heat dissipation challenges with efficient heat transfer for optimal performance and reliable thermal management.
Maximize hole-fill and solder joint reliability with engineered materials, increasing throughput while reducing costs.
Enhance quality and performance with high-reliability formulations for assemblies using diverse pad finishes and thicknesses.
Ensure reliable PCB assembly with high-quality solder alloys that form strong, durable joints for diverse end-use applications.
We provide next-generation material solutions that enhance performance in demanding applications, enabling advanced technology, supporting high reliability, and optimizing throughput and yields for greater efficiency and value.
Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.
Achieve high-frequency designs with our advanced innerlayer treatment systems, enhancing performance for next-gen applications.
Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.
Ensure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.
Achieve MSL-1 performance and reliability with our adhesion promotors, from leadframe roughening to sidewall solderability enhancement.
Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.
Achieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.
Ensure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.
Ensure durability and corrosion resistance with our connector finish technology, delivering reliability and cost efficiency.
Achieve bright, matte, low-stress finishes with high-efficiency electronic plating solutions that enhance durability and reliability.
Get corrosion-resistant, durable finishes with our high-speed, stable precious metal plating processes for demanding applications.
Maximize precision in high-aspect ratio through-hole plating and microvia filling with our advanced copper solutions.
Create advanced mid-aspect-ratio boards with high-throw DC acid copper plating that boosts performance, reliability, and versatility.
Ensure reliable plating for thick, multi-layer PCBs with PPR solutions, offering uniform coverage of high-aspect-ratio through-holes.
Optimize your PCB designs with high-performance copper via filling solutions, engineered to tackle any metallization challenge.
Achieve high reliability in every step of IC substrate manufacturing with our proven solutions, enabling high-density designs.
Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
Drive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
Meet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.
Portfolio of advanced solutions for enhanced uniformity, coplanarity, reliability, and precision for advanced packaging.
Produce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.
Lay the foundation for reliable performance in complex designs with our engineered primary metallization systems.
Enhance reliability and durability with our final finish processes, ensuring exceptional wire bonding and solderability.
Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
Exceed IPC quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
Gain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
Explore OEMs' preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
Lay the foundation for reliable and sustainable performance in complex designs with our engineered primary metallization systems.
Unlock high performance and increased board capacity with our conductive polymer-based direct metallization system.
Achieve sustainability, cost savings, and reliability with our conductive hole-making processes that outperform traditional methods.
Optimize the performance of multilayer boards with high-reliability electroless copper plating for demanding PCB applications.
Our chemistries are designed to meet reliability and performance goals, addressing industry challenges for today’s electronic devices. We deliver innovative, sustainable solutions to a diverse range of markets in the rapidly evolving electronics industry.
Functional Films & Smart Surfaces for Seamless Interfaces.
High-performance materials designed for flexible, formable, and reliable circuits in innovative electronics applications.
Drive sustainable innovation with eco-friendly conductive, dielectric, and carbon inks for bonded flexible printed circuits (FPCs).
Enable highly reliable 3D In-Mold Electronic (IME) smart surfaces with our easy-to-use conductive, dielectric, and carbon inks.
The combination of functional inks with Autostat films enables the fabrication of biosensors, and medical electrodes.
First Surface Hardcoated Films for Smart Interfaces
Increase interface durability and flexibility with textured hardcoated polyester and polycarbonate films for switches and overlays.
Achieve seamless, high-quality finishes with hardcoated films offering deep formability, durability, and aesthetics for automobiles.
Optimize stencil life and simplify prep with high-quality films, emulsions, and chemicals for superior print results every time.
Enhance all stages of the screen print process with our mesh preparation, cleaning, and stencil reclaim chemicals.
Enable high-quality print reproduction with critical accessories for screen print stencil preparation.
Ensure superior stencil preparation with our trusted range of screen print emulsions.
Achieve superior screen print stencils with our photosensitive stencil films, including Capillex and Fivestar.
From simple labels to sophisticated automotive smart surfaces and displays, our flexible films, formable films, and circuit inks enable efficient design and high-yield production of durable, attractive Human Machine Interfaces (HMIs).
Advancing innovative electronics with reliable bondline materials for electronics, photomasks, die attach, packaging and camera modules.
Enhance thermal efficiency and precision with our solder TIM, solder, and flux solutions for advanced chip fabrication.
Advanced solder solutions for interconnecting semiconductor packages, from laminate to leadframe packaging.
Our Semiconductor fluxes for CSP, flip chip, and BGA ball attach deliver high yields, stable performance, and easy DI water cleanup.
Optimize heat management with our Solder Thermal Interface Materials (TIMs).
Camera module adhesives for secure assembly and peak performance.
Ensure durable camera module assembly.
Optimize electronics performance with getters and marking inks for superior bonding and chemical resistance improving device lifespan.
Enhance reliability and performance of hermetic packages.
Ensure long-lasting identification with durable, high-quality marking inks.
Achieve reliable bonds with flexible thermoplastic adhesives.
Secure strong bonds for durable performance.
Maximize yield and reduce cost of ownership with reliable Compugraphics photomasks delivered with fast cycle times.
Ensure optimal power electronics assembly and reliability with our advanced sintering, solder, and copper solutions.
Ensure reliable bonds with advanced sintering materials.
Ensure long-lasting bonds with advanced sintering materials.
Achieve precision with reliable solder preforms for power electronics.
Secure reliable bonds with advanced sintering materials.
Attain high-precision, reliable bonding with our die attach solutions for advanced semiconductor assembly.
Enhance Performance with ATROX® Conductive Materials
Boost Reliability with ATROX Hybrid Sintering
Top-side, die attach, and package attach for power electronics. High-, mid-, low-thermal, non-conductive die attach materials, flip chip & BGA fluxes, fine-feature solder paste, and sTIM.
Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
Transform package performance with advanced interconnect solutions, delivering reliable, uniform, and robust results.
Enable advanced-node manufacturing with dual-damascene processes for bottom-up copper electroplating and void-free metallization.
Optimize pitch reduction, power efficiency, and reliability in advanced interconnect applications with our hybrid bonding solutions.
Enhance reliability in next-generation devices with our high-quality, sustainably sourced low-alpha tin materials.
Unlock best-in-class RDL performance with our RDL solutions, enabling efficient I/O pitch redistribution and advanced plating precision.
Fill TSVs efficiently with our copper plating process, delivering reliable bottom-up plating for complex, high-density packages.
Enhance reliability and performance in next-generation semiconductor packages with advanced wafer bumping metallization solutions.
Enhance reliability and performance in compound semiconductor fabrication with industry-leading precious metal plating technologies.
Optimize via step coverage, yield, and reliability for power/RF with our solutions that integrate seamlessly with die attach material.
Achieve superior bondability, reliability and thermal stability of display driver applications with our high-hardness gold solutions.
Design next-generation Fan-Out Wafer Level Packaging (FOWLP) with our advanced gold and palladium solutions for thin metal films.
Ensure precise, uniform gold seed removal on TiW barriers with advanced, cost-effective gold etchants for semiconductor fabrication.
Enable high plating rates and superior step coverage with our advanced, cost-effective solutions for MEMS fabrication.
Enhance solderability and conductivity with high-purity deposits, seed filling, and adjustable roughness for advanced semiconductors.
Our materials maximize semiconductor performance and reliability for next-generation technologies. With an agile and flexible development process, we deliver unique solutions that provide the lowest cost of ownership and the fastest time to market.
We are the market leader of innovative, integrated specialty chemicals and material technologies which shape the future of circuitry, semiconductors, board assembly, and smart surfaces; improving performance and reliability of electronics products.
Our metallization and wafer level packaging technologies enable complex, high-density interconnect designs. We provide advanced solutions for direct metallization of printed circuit boards, semi-additive copper metallization on IC substrates, and copper plating for TSV interconnects.
When applied in wafer-level packaging, PCB fabrication, and semiconductor assembly, our solutions deliver seamless electrical performance and long-term reliability, reinforcing our commitment to innovation and excellence in connectivity.
We enable reliable circuit pathways that enhance connectivity in high-density designs. Our board-level assembly, circuit fabrication, standard die attach, top-side attach, and package attach solutions create strong, durable bonds with excellent electrical and thermal conductivity for advanced performance.
Our precision bonding technologies reinforce critical components with advanced mechanical and adhesive properties, ensuring reliability and optimal performance in next-generation electronics, even in the harshest of environments.
Formulated to withstand physical shock, vibration, corrosion, and thermal stress, our protective solutions extend component lifespan and reduce risk of failure.
When used in circuit board assembly, our technologies deliver durable protection and consistent performance, reinforcing our commitment to enhanced device reliability.
We offer a wide range of thermal interface material (TIM) solutions for circuit board and semiconductor assembly in high-powered electronics, delivering superior thermal performance without compromising device miniaturization or system complexity.
Our combined solutions ensure optimal thermal regulation, reinforcing our expertise in maintaining device efficiency and reliability.
Our formable and flexible films, combined with advanced circuit materials, enable innovative designs and high-yield production of durable, visually striking Human Machine Interfaces (HMIs).
We create immersive, responsive user experiences that reinforce our leadership in advanced haptic solutions for next-generation devices.
Our electronic solutions support every stage of manufacturing, from wafer fabrication to final assembly, complemented by smart surface films and in-mold electronics solutions.
Precision micro-flux coatings reduce voids, enhance joint integrity, and set new standards for soldering performance.
Tunable copper sintering pastes, adhesives, and inks for die attach, micro-bumping, and via fill—delivering superior heat transfer.
ENIG and ENEPIG final finishes for reliable wire bonding and superior solderability in advanced packaging designs.
Advanced adhesion, flux, and soldering solutions for reliable electronic assemblies in lead-free and tin-lead technologies.
Reliable sinter and die-attach solutions for EV and power electronics, meeting rigorous industry standards.
High-performance conductive and non-conductive die-attach pastes and films for power semiconductors and discrete assemblies.
A low shrink, heat stabilized polyester film with excellent ink adhesion, enabling reliable, high precision flexible circuits & sensors.
Autotype® delivers premium hardcoated films and screen making products rooted in innovation, quality, and heritage.
The efficient, reliable PCB metallization solution preferred by fabricators worldwide over electroless copper.
Delivering reliable, high-precision photomask solutions that ensure quality, speed, and flexibility to meet your manufacturing needs.
Easy-to-use, efficient PCB metallization that delivers high performance, reliability, and durability.
Advanced conformal coatings, encapsulation resins, and thermal management solutions for reliable electronics manufacturing.
Advanced cleaning, etching, and zincate processes for superior nickel coatings on aluminum memory disks.
Trusted organic solderability preservatives, proven in production across diverse lead-free assembly applications.
Polymer-based direct metallization for PCBs enhances board capacity and performance.
Precision solder preforms ensure accurate volumes, improving reliability and efficiency in electronics assembly.
Purest, high-fluidity solder made from virgin metals for unmatched performance and minimal dross.
Drop Shock, Impact Bend, and ATC-tested adhesives, underfills, and encapsulants for soldered components.
High-reliability, lead-free solder alloy for robust performance in harsh environments.
Circuit board assembly materials including traditional soldering chemicals, paste, wire, and bar products.
Engineered copper innovations for high-power electronics.
Premium electroless copper for primary PCB metallization, ensuring high reliability.
High-performance electrolytic copper processes for the plating of through holes and filling of micro vias.
High-quality copper, gold, and solder for WLP, meeting demands of IDM, OSAT, and foundries.
Micromaxtm Electronic Inks and Pastes are highly reliable thick film inks, pastes, ceramic tapes and printed electronic inks.
Advanced copper treatment, promoting adhesion for innerlayer and soldermask applications.
Advanced Cu, Ni, Pd, Ag, and Au solutions for WLP, meeting the demands of IDM, OSAT, and foundries.
Extremely stable immersion tin process with exceptional solderability, even after multiple lead-free assembly reflows.
Electrolytic palladium plating for reliable connectors and interconnects.
High-strength solder with superior thermal fatigue, close to high-lead alloy performance.
A unique, patent-pending reliability toolset integrating solder and polymer data insights for unmatched circuit board assembly perform
Sustainable graphite-based direct metallization, a cleaner alternative to electroless copper.
Advanced moisture, particle, and hydrogen getters designed to enhance performance and reliability across diverse applications.
Versatile adhesives delivering reliable mechanical, electrical, and thermal bonding for both temporary and permanent applications.
Delivers exceptional solder joint strength, touchpad functionality, wire bondability, and in-circuit test compatibility.
Comprehensive IC substrate metallization processes for RDL, through-hole filling, and embedded traces.
Reliable, cost-efficient stencil tensioning that ensures consistent performance without the need for air pressure.
Innovative "frameless" stencils for safer, more secure mounting and demounting.
Preforms that ensure consistent bondline thickness, reducing die tilt in assembly.
Low-stress electroless copper for PTH and micro-via metallization, with reliable, horizontal processing.
Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.
Comprehensive guidance and expertise with XtraForm® materials, process mapping, product design, and production processes.
High-performance hardcoated, formable 3D films for durable, seamless integration of electronics in automotive surfaces.
High-performance materials engineered for reliability in extreme conditions. Our solutions connect, protect, interconnect, and reinforce circuitry in powertrain, in-cabin, lighting, and safety system automotive electronics assemblies.
We engineer soldering materials, reinforcement polymers, and circuitry formation solutions to increase throughput, reduce costs, and deliver reliable connections across all types of computer-related assemblies.
For consumer electronics PCB assembly and semiconductor manufacturing, our integrated products, expertise, and innovative processes enable designers to miniaturize components, enhance performance, and reduce the total cost of ownership.
In addition to providing connectivity and heat dissipation between components, our materials protect PCBs and enhance touchscreen strength. Our high-performance solder alloys also resist damp environments, all contributing to extended component life.
We improve the reliability of medical components and assemblies while reducing costs and enhancing manufacturing efficiency. Our electronics solutions for the medical industry meet performance specifications and support device-level FDA approval.
Our circuitry formation, board, and semiconductor assembly products ensure reliability in electronic solutions for military and aerospace applications. Trusted by PCB fabricators, they deliver robust performance even in the harshest environments.
Our electronic solutions for mobile phone assembly cover wafer-level packaging, circuit metallization, semiconductor, and board assembly, helping companies build the most complex components used in advanced smartphone devices today.
Sinter materials, high-reliability solder, reinforcement polymers, and thermal interface materials reduce thermal resistance, protect in harsh environments, and dissipate excess heat, significantly improving efficiency and performance.
Our connecting and interconnecting materials enable green energy electronics, including module assemblies, microinverters, and PV ribbon and wire manufacturing, enhancing efficiency and performance, even in high-voltage applications.
We engineer integrated solutions that offer high electrochemical reliability, excellent thermal and electrical conductivity, high throughput, and low defects—ensuring superior performance and efficiency in your telecommunications electronic service hardware.
We deliver unmatched reliability and performance across diverse electronic markets with integrated materials that connect, interconnect, reinforce, protect, manage heat, and enhance haptics and touch capabilities.
Join an organization with over 100 years of innovation and a culture built on character and collaboration. We have created a work environment where you can truly thrive.
MacDermid Alpha Electronics Solutions, a business unit of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials, helping to deliver enhanced performance, reliability, and sustainability to electronics manufacturers worldwide.
Contact Us
Mexico City office Av. Nafta No. 800 , Parque Ind. STIVA Aeropuerto, 66600 Apodaca, N.L. Norte 59 No 896, 02300 Col Industrial Vallejo 02300 Azcapotzalco, CDMX 02300 Mexico City, CDMX Mexico
