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Press Release
High Reliability Assembly Solutions featured at EMS-Tag, Germany
MacDermid Alpha Electronics Solutions, will exhibit its range of innovative assembly solutions for the electronics manufacturing services industry at the upcoming EMS-Tag conference and exhibition on Thursday 8th September in Würzburg, Germany.
Assembly
Press Release
New ALPHA HiTech AD13-9910B Ultra-Low Temperature Adhesive
MacDermid Alpha Electronics Solutions, announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates.
Assembly
Press Release
MacDermid Alpha to Showcase Latest Circuit Board Assembly Innovations at Upcoming SMTA Expos
MacDermid Alpha Electronics Solutions, will highlight its range of advanced solutions for circuit board assembly at the upcoming SMTA Queretaro Expo, Mexico on August 18th, SMTA Ohio Expo, USA on August 24th and SMTA Chihuahua Expo on August 25th.
Assembly
Press Release
'Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells' Article Published in SMT007 Magazine
Narahari Pujari, Senior Global Product Manager, PV and Krithnika PM discuss ‘Solder Paste Printing and Optimizations for Interconnecting Back Contact Cells’ in latest article published in July's SMT007 Magazine.
Assembly
Press Release
High Performance Solder Alloys Presented at Automotive Applications at HiTEN 2022
MacDermid Alpha Electronics Solutions, will present its High Performance Solder Alloys for Automotive Applications at the International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK from the 18th-20th July.
Assembly
Press Release
MacDermid Alpha Appoints Barbieri and Kosmedue as Official Kester Distributors in Italy
MacDermid Alpha Electronics Solutions, is excited to announce the extension of the distribution partnerships with current Italian ALPHA brand distributors Barbieri and Kosmedue to include the distribution of Kester brand products in Italy.
Assembly, Circuitry, Semiconductor
Press Release
Product launch of ALPHA HRL3 Solder Sphere
MacDermid Alpha Electronics Solutions, announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications.
Assembly
Press Release
Low Voiding Solutions Paper to be Presented at SMTA Juarez
The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will present a paper on low voiding solutions at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Assembly, Semiconductor
Press Release
MacDermid Alpha to Promote New ALPHA® Argomax® AccuLam™ Sintering Film and Package Attach Sintering Application at PCIM Europe
MacDermid Alpha Electronics Solutions, will showcase its latest sintering process solutions, including the new ALPHA Argomax AccuLam Sintering Film, at the upcoming PCIM exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 7 Booth #227.
Assembly
Press Release
High Reliability Solutions and Recycling Services featured at SMTA Michigan Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.
Assembly
Press Release
Low Temperature Soldering and Conformal Coating Innovations presented at SMTconnect
MacDermid Alpha Electronics Solutions, will showcase its latest product innovations from the ALPHA, Kester and Electrolube brands at the upcoming SMTconnect exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 4 Booth # 125.
Assembly
Press Release
Webinar offered on Innovative Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
MacDermid Alpha Electronics Solutions, in partnership with Globalspec will host “Low Temperature Solder Solutions for Defect-free Next Generation Package Designs” webinar presented by Paul Salerno, Global Portfolio Manager for SMT Solutions on Wednesday, May 25 at 2:00 pm EDT.
United States
IMAPS Device Packaging Conference & Expo 2023
Trade Show
Circuitry, Semiconductor
Discover solutions for advanced interconnect metallization and assembly materials used in leading-edge chip fabrication and wafer-level packaging. MacDermid Alpha supplies leading-edge technologies that enable the highest end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry. Booth 31-32
United Kingdom
Nissan Supplier Engagement Day
Conference
Assembly
MacDermid Alpha will showcase its unique range of materials and technology expertise for automotive smart surfaces including XtraForm™ hardcoated films suitable for the latest highly functional In-Mold Electronics processes as well as XMAPP, its superior quality system for automotive applicators that delivers global supply chain consistency.
United States
Silicon Valley Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
United States
IPC APEX 2023
Trade Show
Assembly, Circuitry, Semiconductor
Discover the latest Assembly, Circuitry, and Semiconductor Technologies.
China
SNEC China Conference & Expo
Conference
Assembly
MacDermid Alpha will be delivering a paper on its latest technology for optimizing multi busbar cell interconnection.
United States
IMAPS Device and Packaging 2022 Booth # 23/24
Trade Show
Assembly, Circuitry, Semiconductor
Discover the latest solutions of Alpha, Electrolube, Kester, MacDermid Enthone, and Electrolube # 23/24
United States
SMTA Rocky Mountain Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover Alpha and Kester’s latest solutions for solder joint ruggedization at this one-day event.
United States
APEC- Applied Power Electronics Conference
Conference
Assembly
Gyan Dutt will be delivering a paper, Automotive Traction Module Attach by Silver Sintering, at the Applied Power Electronics Conference (APEC) which focuses on the practical and applied aspects of the power electronics business.
United States
SMTA Dallas Chapter Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Visit our table at this one day event to discover our latest high reliability and low temperature assembly solutions.
Germany
LOPEC 2022 International Exhibition / Conference for Printed Electronics
Conference
Assembly
International Exhibition and Conference for Printed Electronics. LOPEC is the leading conference and exhibition on the hot topic of organic and printed electronics. MacDermid Alpha will be presenting its latest research at this event.
United States
Huntsville Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Featuring ALPHA OM-565 HRL3 solder paste, high reliability solutions including ALPHA CVP-390V and Kester NP505-HR solder pastes with Innolot alloy, and the ALPHA HiTech series of adhesive, edgebond, and underfills.
United States
Panel Discussion on Head-in-Pillow defects. Global Webinar hosted by Global SMT& Packaging.
Webinar/Online
Assembly
Kevin Martin joins a panel of industry experts hosted by Global SMT& Packaging to discuss head-in-pillow (HiP) defects, causes, and solutions.
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