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Assembly, Circuitry, Semiconductor
News
Earth Day
To commemorate Earth Day and the anniversary of our businesses, we are excited to announce that the ESI Foundation has made a $15,000 donation to The Canopy Project.
Assembly, Semiconductor
Press Release
Electrolube to Showcase Conformal Coatings Expertise at SbSTC Shenzhen Technical Conference
MacDermid Alpha Electronics Solutions, will showcase the Electrolube’s newest advances in Conformal Coatings and Encapsulation Resin technologies at their first of four SbSTC technical conferences.
Assembly, Circuitry, Semiconductor
News
The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority.
Assembly
Press Release
MacDermid Alpha Expert to Participate in Panel on Solutions for Head-in-Pillow Defects
Kevin Martin of the Assembly Division at MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, “Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?” on April 19 at 10:30 am New York / 3:30 pm London.
Assembly, Circuitry, Semiconductor
Press Release
New Global Product Managers Appointed for the Electrolube Brand of Resins and Coatings
MacDermid Alpha Electronics Solutions has announced the appointments of Saskia Hogan and Beth Massey as new Global Product Managers for the Electrolube brand.
Assembly, Circuitry, Semiconductor
Press Release
New Low Temperature Solder Paste to be featured at SMTA Huntsville Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
Assembly
News
Ravi Bhatkal presents to The Centre for Nano Science and Engineering (CeNSE)
Ravi Bhatkal, Managing Director - India, presented to The Centre for Nano Science and Engineering (CeNSE) on Advanced Materials in Electronics Manufacturing.
Assembly
Multimedia
Watch interview with Paul Salerno discussing applications & advantages of low temperature solders
Watch interview with EMSNOW - Up Close With Paul Salerno on applications and advantages of low temperature solder.
Assembly, Circuitry, Semiconductor
Press Release
Technical Presentation on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference
MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.
Assembly
Press Release
Product Launch - ALPHA® OM-565 HRL3, Next Generation, Low Temperature Solder Paste
MacDermid Alpha Electronics Solutions, announces the launch of ALPHA OM-565 HRL3, next generation, high reliability low temperature solder paste formulated for a broad range of assemblies to mitigate warpage induced defects in temperature sensitive chip-scale packages.
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha to feature enhanced reliability solder pastes at SMTA Rocky Mountain & Dallas Expos
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Thursday, March 10 and at the SMTA Dallas Expo & Tech Forum on Tuesday, March 22.
Assembly, Circuitry, Semiconductor
Press Release
MacDermid Alpha Releases CircuEtch 300 Anisotropic Final Etch for SAP and mSAP
MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing.
Romania
ESTC 2022
Conference
Assembly, Semiconductor
The Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. MacDermid Alpha will highlight its latest innovations for power electronics and semiconductor applications including ALPHA Argomax sinter materials.
Taiwan
Semicon Taiwan
Trade Show
Assembly, Circuitry, Semiconductor
MacDermid Alpha will feature its entire portfolio of technologies that enable end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry. Visit us in Hall 1 Booth # L0500.
Mexico
SMTA Guadalajara Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover Alpha and Kester’s latest solutions at this two-day event.
Netherlands
TechBlick 2022
Trade Show
Assembly, Semiconductor
MacDermid Alpha's innovative materials for flexible hybrid, printed and in-mold electronics will be showcased at the TechBlick Expo and Conference.
Germany
Automotive Interiors Expo 2022
Trade Show
MacDermid Alpha will showcase its proven automotive range of XtraForm films for smart surface interiors at this year’s Automotive Interiors Expo.
China
Productronica South China 2022
Trade Show
Assembly
Discover solutions that enable the manufacture of extraordinary electronic devices at high productivity & reduced cycle time.
United States
Webinar: STAYSTIK® Assembly Adhesives for Circuit Board, Device and Wafer level Applications
Webinar/Online
Assembly, Circuitry, Semiconductor
United States
SMTA International
Trade Show
Assembly, Circuitry, Semiconductor
MacDermid Alpha will present five technical papers during the SMTA International Conference. The latest solutions from the Alpha, Electrolube, Kester, and MacDermid Enthone brands of MacDermid Alpha Electronics Solutions will be on exhibit at Booth 1018.
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