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Assembly
Press Release
High Reliability Solutions and Recycling Services featured at SMTA Michigan Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, May 17.
Assembly
Press Release
Low Temperature Soldering and Conformal Coating Innovations presented at SMTconnect
MacDermid Alpha Electronics Solutions, will showcase its latest product innovations from the ALPHA, Kester and Electrolube brands at the upcoming SMTconnect exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 4 Booth # 125.
Assembly
Press Release
Webinar offered on Innovative Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
MacDermid Alpha Electronics Solutions, in partnership with Globalspec will host “Low Temperature Solder Solutions for Defect-free Next Generation Package Designs” webinar presented by Paul Salerno, Global Portfolio Manager for SMT Solutions on Wednesday, May 25 at 2:00 pm EDT.
Assembly, Circuitry, Semiconductor
News
Earth Day
To commemorate Earth Day and the anniversary of our businesses, we are excited to announce that the ESI Foundation has made a $15,000 donation to The Canopy Project.
Assembly, Semiconductor
Press Release
Electrolube to Showcase Conformal Coatings Expertise at SbSTC Shenzhen Technical Conference
MacDermid Alpha Electronics Solutions, will showcase the Electrolube’s newest advances in Conformal Coatings and Encapsulation Resin technologies at their first of four SbSTC technical conferences.
Assembly, Circuitry, Semiconductor
News
The Carbon Footprint of HDI: Direct Metallization vs. Electroless Copper
As the electronics supply chain contends with the struggles of moving out of the pandemic and into a new normal, it is increasingly obvious that a new normal will be one with sustainability and resource conservation as the top priority.
Assembly
Press Release
MacDermid Alpha Expert to Participate in Panel on Solutions for Head-in-Pillow Defects
Kevin Martin of the Assembly Division at MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, “Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?” on April 19 at 10:30 am New York / 3:30 pm London.
Assembly, Circuitry, Semiconductor
Press Release
New Global Product Managers Appointed for the Electrolube Brand of Resins and Coatings
MacDermid Alpha Electronics Solutions has announced the appointments of Saskia Hogan and Beth Massey as new Global Product Managers for the Electrolube brand.
Assembly, Circuitry, Semiconductor
Press Release
New Low Temperature Solder Paste to be featured at SMTA Huntsville Expo & Tech Forum
The Assembly Division of MacDermid Alpha Electronics Solutions, will exhibit at the SMTA Huntsville Expo & Tech Forum on Tuesday, April 12 at The Jackson Center.
Assembly
News
Ravi Bhatkal presents to The Centre for Nano Science and Engineering (CeNSE)
Ravi Bhatkal, Managing Director - India, presented to The Centre for Nano Science and Engineering (CeNSE) on Advanced Materials in Electronics Manufacturing.
Assembly
Multimedia
Watch interview with Paul Salerno discussing applications & advantages of low temperature solders
Watch interview with EMSNOW - Up Close With Paul Salerno on applications and advantages of low temperature solder.
Assembly, Circuitry, Semiconductor
Press Release
Technical Presentation on High Reliability Materials for 3D Structural Electronics at LOPEC 2022 Exhibition and Conference
MacDermid Alpha Electronics Solutions, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 - 24, 2022 at the Messe München, Germany.
China
SbSTC Shenzhen Technical Conference 2022
Conference
Assembly
Harvey Han, Product Manager of Electrolube, will be presenting a paper related to conformal coating at the SbSTC Shenzhen technical conference.
Mexico
Juarez Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover MacDermid Alpha’s low voiding solutions which increase reliability, enhance electrical and thermal performance, and eliminate costly rework. Additionally, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum.
United States
Low Temperature Solder Solutions for Defect-free Next Generation Package Designs
Webinar/Online
Assembly
Webinar May 25 at 2 pm EST. Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.
United States
MacDermid Alpha Webinar: “The Critical Role of Getters in Hermetic Packages”
Webinar/Online
Circuitry, Semiconductor
Michael Previti will be presenting “The Critical Role of Getters in Hermetic Packages”.
Japan
JPCA Show
Trade Show
Assembly, Circuitry, Semiconductor
MacDermid Alpha Electronics Solutions will be exhibiting at the JPCA show in Tokyo, Japan.
United Kingdom
HiTEN 2022
Conference
Assembly
Alan Plant will be delivering the paper ‘Unveiling High Performance Solder Alloys for Automotive Applications’ at the upcoming International Conference and Exhibition on High Temperature Electronics Network (HiTEN) in Oxford, UK.
United States
Sensors Converge
Trade Show
Assembly, Circuitry
Join the sensors and electronics community at this event covering the biggest design engineering trends. From sensors and chips to the cloud, Sensors Converge covers the technologies and applications driving innovation today. Visit us at Booth 1637 to discover our latest printed and in-mold ink technology.
United States
Ohio Valley Expo & Tech Forum
Roadshow
Assembly, Circuitry, Semiconductor
Discover Alpha and Kester’s latest solutions at this one-day event.
Germany
EMS Tag
Trade Show
Assembly
The EMS-Tag is considered one of the most important events in the Electronics Manufacturing Services industry. At this event, MacDermid Alpha will highlight its range of advanced circuit board assembly solutions.
United States
Electric & Hybrid Vehicle Tech Expo / Battery Tech USA
Trade Show
Assembly
MacDermid Alpha will feature its latest Argomax power electronics technologies for inverters and Electrolube solutions for thermal management in batteries at booth 1211.
Romania
ESTC 2022
Conference
Assembly, Semiconductor
The Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. MacDermid Alpha will highlight its latest innovations for power electronics and semiconductor applications including ALPHA Argomax sinter materials.
Taiwan
Semicon Taiwan
Trade Show
Assembly, Circuitry, Semiconductor
MacDermid Alpha will feature its entire portfolio of technologies that enable end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry. Visit us in Hall 1 Booth # L0500.
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