News & Events

MacDermid Alpha, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023. MacDermid Alpha’s expertise and product portfolio will be on display in hall 7, booth 460.

(Waterbury, CT USA) – April 5, 2023 – MacDermid Alpha, will be participating at Productronica China, April 13-15, 2023, at the Shanghai New International Exhibition Center (SNIEC) Shanghai. Visitors are welcome to booth 4528, Hall 4 to speak to our team of experts.

(Waterbury, CT USA) – April 6, 2023 – MacDermid Alpha, has expanded the Argomax® technology offering. Argomax® 2141 is a new silver sintering product, designed for electric vehicle power inverters. The sintered joint enables the fabrication of smaller, lighter, and reliable power train systems.

MacDermid Alpha, will present its latest research on high-speed copper plating at the 19th Annual Device Packaging Conference (DPC 2023), held March 13-16, at the We-Ko-Pa Conference Center in Fountain Hills, Arizona. Engage the industry experts at booth 31-32, where MacDermid Alpha will showcase the performance benefits of advanced materials for die attach, chip fabrication, and wafer-level packaging.

MacDermid Alpha, will showcase automotive, 5G infrastructure, mobile devices, film, and surface finishing technologies at the Source India show; Chennai Trade Centre, February 13-14. Powering a path to the future of chemicals utilized in electronic applications, MacDermid Alpha will exhibit at booth A17-A20 in Hall 1, reflecting their strong local presence in India and ongoing support to resident OEMs, EMS providers, ODMs, CEMs, and distributors.

As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next-generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.

MacDermid Alpha, will be highlighting their latest research on final finishes, lightweight bio-based polymers, solder alloy reliability for automotive applications, and brand new findings from test data on conformal coatings. The four separate technical presentations will take place at this year’s IPC APEX EXPO, January 24 – 26, at the San Diego Convention Center in California.

MacDermid Alpha will highlight its latest polymer and solder paste offerings at the upcoming SMTA Silicon Valley Expo taking place on December 8 at the Juniper Dome in Sunnyvale, California.

MacDermid Alpha Electronics Solutions, will be showcasing their unrivalled total process solutions at this year’s Automotive Electrical & Electronics Summit. With over 300 delegates expected from all over India and overseas, the Automotive Electrical & Electronics Summit will take place at the Hotel Feathers in Chennai, India, on the 8th December.

MacDermid Alpha will exhibit its latest interconnect solutions and present five papers at the SMTA International Expo and Conference taking place October 31 – November 3 at the Minneapolis Convention Center in Minneapolis, MN.

MacDermid Alpha Electronics Solutions, will be highlighting their unrivalled capabilities as a total process solutions provider at this year’s Productronica South China, which takes place at the Shenzhen World Exhibition and Convention Center, 15-17 November 2022, on the MacDermid Alpha Stand 6D42 in Hall 6..