Product Overview

High activity, low voiding Water Soluble Solder Paste

ALPHA WS-698CPS is a high activity solder paste designed for a broad range of applications. ALPHA WS-698CPS broad processing window is designed for stencil printing application for either surface mount or solder bumping process.

Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. It is design to provide consistent fine pitch printing capability with wide range of solder powder size ranging from T4 to T5.

Features

  • Low voiding Performance
  • Maximizes reflow yield for lead-free processing
  • Excellent print consistency with high process capability index
  • Reduction in random solder balling levels, minimizing rework and increasing first time yield.

ALPHA WS-698CPS is a next generation water soluble solder paste specifically designed for fine pitch and high density applications.

Technical Data Sheet
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TDS-icon

ALPHA WS-698CPS Solder Paste TDS English

ALPHA WS-698CPS

Product Name

Paste Type

Alloy Type

Feature Capability

Paste Component Type

ALPHA WS-698CPS

Water soluble

Lead-Free

Standard Pitch
Fine Pitch
Ultra Fine Pitch
 

SiP
MPU/CPU-passives

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