Product Overview

ALPHA NCP-LR002 is a lead-free, no-clean solder paste designed for applications where high soldering activity, low voiding and very low flux residues are desired.

This product is designed to enable consistent fine pitch printing capability and almost “zero” residue cosmetic appearance after reflow. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability.

Features

  • Almost “no residue” cosmetic appearance
  • Excellent voiding performance
  • Excellent print consistency with high process capability index across all board designs 
  • Wide reflow profile window with good solderability on various board

ALPHA NCP-LR002 is a no-clean low residue solder paste designed for a broad range of applications.

Technical Data Sheet
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TDS-icon

ALPHA NCP-LR002 Solder Paste TDS English

ALPHA NCP-LR002

Product Name

Paste Type

Alloy Type

Feature Capability

Paste Component Type

ALPHA NCP-LR002

No clean

Lead-Free

Standard Pitch

SiP
MPU/CPU-Passives

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