Product Overview

ALPHA NCP-390 is a lead-free, zero-halogen, no-clean solder paste designed for applications where high soldering activity, low voiding and clear flux residues are required.

This product is designed to enable consistent fine pitch printing capability down to 70μm stencil opening with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. ALPHA NCP-390 is also available as a dispensing solder paste for low voiding applications

Features

  • Excellent solder joint and flux residue cosmetics 
  • Excellent voiding performance
  • Long stencil life: consistent performance for at least 8-hours of continuous printing
  • Robust tack force ensures high pick-and-place yields, good self-alignment

No-Clean, Lead-Free, Zero-Halogen Solder Paste, Low Voids, Fine Feature, Excellent Pin Test Performance

ALPHA NCP-390
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TDS-icon

TDS

ALPHA NCP-390

Product Name

Paste Type

Alloy Type

Feature Capability

Paste Component Type

ALPHA NCP-390

No Clean

Lead-Free

Standard Pitch
Fine Pitch
Ultra Fine Pitch
Dispensing

SiP
Wafer Bumping
MPU/CPU-Passives

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