ALPHA® NCP-390 Solder Paste
No-clean, lead-free solder paste meets zero-halogen specs with low voiding and excellent fine-feature printing performance.
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ALPHA NCP-390 is designed to enable consistent fine-pitch printing capability down to a 70μm stencil opening, with a wide range of solder powder sizes ranging from T4 to T7. Its excellent print volume deposit repeatability provides value by reducing defects associated with print process variability. It's also available as a dispensing solder paste for low-voiding applications.