ALPHA® WS-608 Flux
High-activity, water-soluble paste flux that offers excellent solder wetting, easy cleaning, and low voiding performance.
Contact Us
Product Overview
ALPHA WS-608 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. It is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Gold (ENIG) pad finishes, and can also be used as a pre-cleaning agent for oxidized Cu-OSP boards.
Our high-activity formulation enables single-step ball attach on Cu-OSP and provides performance advantages in wetting, spread, and missing ball rate/yield. The material is halogen-free compliant and designed to deliver consistently high results in demanding applications.