ViaForm®
Copper damascene chemistries that deliver proven uniform interconnect fill and superior reliability for wafer fabrication.
Contact UsProduct Overview
ViaForm copper damascene chemistries deliver superior filling performance for wafer fabrication. Each chemistry is specifically designed for manufacturing advanced copper interconnects and provides a high degree of process control. ViaForm enables robust interconnect fill capability, ensuring superior device yield and reliability.
Product Features
Unique Custom Solutions
Custom solution packages leveraging the latest ViaForm products, developed through close customer collaboration.
Pioneering Advanced Copper Technologies
ViaForm delivers fast, void-free fill with a broad operating window, excellent across wafer uniformity, and customized impurity control to meet reliability needs.
Best-in-class Manufacturing Capability
ViaForm chemistry is produced in our High-Volume Manufacturing (HVM) and advanced research facilities.
Advanced Copper Plating Technology
ViaForm offers a clear advantage in meeting the demands of shrinking device geometries while allowing chip manufacturers to utilize their existing processes and tool systems. This is especially important in the production of memory and logic devices. Our next-generation process technology ensures a high degree of process control.
Solutions to Meet Every Manufacturing Requirement
Our high-volume manufacturing facility features computer-integrated manufacturing, fully automated enclosed chemical distribution, and dedicated processing streams. The facility ensures stringent batch-to-batch control and consistency, readily meeting demanding manufacturing requirements worldwide.
Featured Applications
Wafer Fabrication
ViaForm products, used in the dual-damascene process, enable bottom-up copper electroplating to achieve void-free metallization of complex nano patterns.