ALPHA® TrueHeight® Solder Preforms For Power Electronics
Engineered Solder preforms with embedded bondline control to prevent tilt, address warpage, and ensure consistent joint thickness.
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ALPHA TrueHeight Preforms contain embedded bondline control wires that maintain a minimum bondline of the solder joint after reflow, ensuring solder joint reliability. Multiple bondline control mechanisms can be included in a single solder preform to prevent tilt while ensuring a minimum bondline for applications such as warped substrate soldering. These preforms are available in a wide range of sizes, suitable for clip attachment, as well as substrate and heat spreader attachment applications.