STAYCHIP® F614-3A
A thermosetting adhesive with electrical insulation, designed for bonding and sealing semiconductor packages.
Contact UsProduct Overview
STAYCHIP F614-3A is a thermosetting adhesive with electrical insulating properties. It is designed for attaching or sealing high-reliability semiconductor packages and electronic assemblies, with the capability to attach a metal can or lid onto a package. STAYCHIP F614-3A was specifically developed for superior adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates.
Product Features
Non-conductive and Electrically Insulating
Ensures no electrical interference in sensitive electronic components.
Superior Adhesion
Developed for excellent adhesion to metal lid surfaces, epoxy laminate, or solder mask-coated substrates.
Thermosetting
Cures upon heating, providing a strong and durable bond.
Chemical Type
The adhesive is a thermosetting material, curing and hardening upon heating.
Color
STAYCHIP® F614-3A is black in color, making it suitable for applications where a dark adhesive is preferred.
Filler Type
The adhesive contains silica as a filler, enhancing its mechanical properties and stability.
Viscosity
At 25°C and 0.5 RPM, the viscosity of the adhesive is approximately 200 Kcps, while at 25°C and 5.0 RPM, it is around 45 Kcps.
Glass Transition Temperature (Tg)
The glass transition temperature is 117°C when measured via TMA and 122.76°C when measured via DSC.
Semiconductors
Featured Applications
Attachment or Sealing
Ideal for attaching or sealing high-reliability semiconductor packages and electronic assemblies.
Lid Attachment
Specifically developed to attach metal cans or lids onto packages.
Screen Printing
Can be applied via dispensing or screen printing operations, making it versatile for various manufacturing processes.