POLYSOLDER® SE3001
Conductive adhesive cures with Infrared (IR), convection, conduction, or vapor phase. Fast, low-temp curing, stable, reliable contact.
Contact UsProduct Overview
The material is cured by thermal processing in IR, convection, conduction, or vapor phase equipment. A combination of short cure time, low-temperature cure, and excellent thermal stability results in superior mechanical properties and stable contact resistance during stress tests and device operation. Overall, it is an electrically conductive adhesive with extremely low outgassing and fast bonding to a variety of substrates.
Product Features
Electrically Conductive
Ensures reliable electrical connections in electronic assemblies.
Fast Curing
Can be cured quickly using thermal processing methods such as Infrared (IR), convection, conduction, or vapor phase equipment.
Low Outgassing
Meets MIL-STD-883 requirements, making it suitable for sensitive applications.
Chemical Type
The adhesive is a thermosetting material that cures and hardens when heated.
Color
POLYSOLDER® SE3001 is grey in color, making it ideal for applications where a neutral adhesive is preferred.
Filler Type
The adhesive contains silver as a filler, ensuring excellent electrical conductivity.
Viscosity
At 25°C and 1 RPM, the viscosity of the adhesive is approximately 180 Kcps, while at 25°C and 10 RPM, it is around 30 Kcps.
Glass Transition Temperature (Tg)
The glass transition temperature is 90°C, indicating the point at which the adhesive transitions from a hard, glassy state to a more rubbery state.
Semiconductors
Featured Applications
Electric Assemblies
Ideal for creating reliable electrical connections in various electronic devices.
Screen Printing
Screen Printing and Stenciling: Suitable for screen printing and stenciling processes, providing flexibility in manufacturing.
Thermal Management
Effective in applications that require good thermal conductivity and stability.