Kester® InAg sTIM
A sintered indium-silver thermal interface material designed for high-performance semiconductor applications.
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Thermal Interface Material (TIM) development is increasingly important as semiconductor packages advance in performance and functional integration. With junction resistance values steadily decreasing, traditional organic-based TIMs are nearing their performance limits in high-power applications. Kester indium-based solder TIMs offer high thermal conductivity, making them a strong candidate for the next generation of TIM interconnect solutions.