Kester® TSF-6592HF Tacky Solder Flux
A no-clean, lead-free paste flux for flip chips, BGAs, SMDs, and other lead-free soldering needing tacky flux.
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Kester TSF-6592HF is a no-clean paste flux designed as a lead-free solution for a range of interconnect applications, including flip chip attach, sphere or ball attach, and rework or repair of Chip Scale Packaging's (CSPs), Ball Grid Arrays (BGAs), and Surface Mount Devices (SMDs). It is ideal for any lead-free soldering process that requires a very tacky flux and is optimized for consistent, high-speed printing.