ALPHA® WS9180-MHV Flux
Water-soluble, offers excellent wetting on wafer surface with reliable performance
Contact UsProduct Overview
ALPHA WS9180-MHV water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto wafer or panel surfaces. The flux is highly compatible with Cu, Cu-OSP, electrolytic Ni-Au, and ENIG pad finishes. ALPHA WS9180-MHV is a halogen-free, compliant material with strong fluxing activity, offering performance advantages in wetting, spread, and missing ball rate/yield.
Best for Wafer / Panel Soldering
Good printing performance and activity enable the best soldering yield on various types of wafer/panel surfaces.
Diverse Applicability
Suitable for soldering a variety of lead-free and tin-lead eutectic alloys onto wafer and panel-level surfaces.
Product Documentation
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