ALPHA® WS9180-MHV Flux

Water-soluble paste flux for wafer-level ball attach in Fan-in and Fan-out applications.

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Product Overview

ALPHA WS9180-MHV water-soluble, halide-free flux is engineered for use in the attachment of lead-free or tin-lead eutectic spheres onto Ball Grid Array (BGA) or Chip Scale Packaging (CSP) components, as well as ball drop on Wafer Level Chip Scale Package (WLCSP) applications. It is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) pad finishes, with best-in-class fluxing activity resulting in maximized yield.

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