ALPHA® WS698CPS Solder Paste
High-activity, water-soluble lead-free solder paste offers high yields, low voiding, and excellent residue cleaning performance.
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ALPHA WS-698CPS is a high-activity solder paste formulated for a broad range of stencil printing applications, including surface mount and solder bumping processes.
Its outstanding reflow process window enables reliable soldering on Copper Organic Solderability Preservative (CuOSP) with excellent coalescence across varying deposit sizes, strong resistance to random solder balls, and robust mid-chip solder ball performance. The paste provides consistent fine-pitch printing and is compatible with solder powder sizes ranging from T4 to T5.