M-Copper Omega®
High-dep metallization process combining a patented activation sequence with a statistically designed electroless copper bath.
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Product Overview
The M-Copper Omega is a high-deposition metallization process that combines a unique, patented activation sequence with a statistically designed electroless copper bath. The patented activation sequence utilizes nontraditional conditioning and acceleration steps to enhance glass coverage. This enhanced coverage yields superior post-pattern plate backlight performance. The statistically designed electroless copper bath produces the highest reliability on microvias and high aspect ratio holes.