Via Dep® 4550

Electroless copper system for difficult-to-plate substrates, offering superior adhesion while maintaining structural integrity.

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Product Overview

Via Dep® 4550 electroless copper system is specially designed for difficult-to-plate substrates. The 4550 process offers superior adhesion on inert surfaces and difficult structural designs while maintaining structural integrity. The zero-stress, blister-free deposit for Semi-Additive Process (SAP), Modified Semi-Additive Process (mSAP), and flex applications ensures metallization needs on complicated hybrid devices can be met with ease. Via Dep 4550 H is formulated for horizontal lines.

Product Features

Electroless Copper
Stress Free Copper Deposit

Via Dep 4550 passes IPC-TM-650 thermal stress testing for plated through-holes.

Enabling Difficult-to-Plate Substrates

Compatible with flex, rigid-flex, and rigid Printed Circuit Board (PCB) designs for complex hybrid devices.

Delivering Operating Cost Efficiencies

Via Dep 4550 operates at low temperatures, enabling reduced operating costs. The system is also a drop-in replacement for existing electroless copper lines.

SAP, mSAP, and Flex

Zero-stress, blister-free deposit for SAP, mSAP, and flex applications on complex hybrid designs.

Through Hole Plating

Product Documentation

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