ENTEK^® PLUS HT

The Entek Plus HT process provides a superior lead-free final finish and maintains exceptional solderability through multiple lead-free processing steps, delivering the highest reliability in Ball Grid Array (BGA) solder joint strength.

This production-proven process meets the challenges of lead-free assembly while maintaining eutectic compatibility and process capability. It is specially designed for mixed-metal applications, such as Electroless Nickel Immersion Gold (ENIG). The Organic Solderability Preservative (OSP) selectively deposits on copper while leaving gold connectors or metallic heat sinks free of contamination.

Using Entek Plus HT results in reduced rejects and scrap, along with the highest reliability and first-pass assembly yields.