ORMECON^® CSN

ORMECON CSN Classic is a series of highly stable immersion tin processes that meet the requirements for all high-technology markets that qualify immersion tin final finishes. Based on a patented organic metal pre-dip, these processes have been production-proven to reduce copper-tin diffusion speed by up to 65% and catalyze tin deposition. As a result, exceptional solderability and appearance are maintained, even after multiple lead-free assembly reflows.

Ideally suited for press-fit technology, backplanes, and fine-pitch applications, ORMECON CSN Classic processes can be operated with either Methanesulfonate (MSA) or sulfuric acid-based systems, offering the most flexible immersion tin plating solutions in the industry. The robust process window ensures stable plating quality over an extended bath life. The low operating temperature, ease of rework, and excellent deposit properties make ORMECON CSN Classic the immersion tin process with the best overall cost of ownership.

The processes utilize an organic nanometal contained in the ORMECON OMP 7000 series pre-dip. ORMECON CSN Classic’s patented pre-dip creates a mild barrier to copper diffusion into the tin, while also producing a unique low-stress grain structure that significantly reduces whisker formation. Additionally, the pre-dip enhances the Printed Circuit Boards (PCB’s) resistance to oxidation and copper diffusion, reducing the risk of tin melting by creating an immersion tin with low silver content in the bulk of the deposit.