Affinity™ ENIG
Optimized process that creates an extremely uniform nickel-phosphorus distribution and low variation in pad-to-pad gold thickness.
Contact UsProduct Overview
Each process step of Affinity Electroless Nickel/Immersion Gold (ENIG) is optimized to work together, creating an extremely uniform nickel-phosphorous distribution and low variation in pad-to-pad gold thickness. As a result, the entire process is highly resistant to penetrating corrosion and easily conforms to all known specifications, including the stringent IPC 4552 A and B.
Product Features
Developed with Six Sigma Methodology
A data-driven approach, from concept to mass production, eliminates waste, improves yield, and enhances reliability by minimizing process variation.
Significant Cost of Ownership Improvements
Elimination of dummy waste, maximized bath life, reduced chemical waste and maintenance, and best-in-class use of precious metals.
Reduced Corrosion
Consistently low electroless nickel corrosion, providing the highest level of conformance to IPC 4552 A and B.
Tighter Gold Window and Dummy Free Operation
The latest Institute of Printed Circuit Boards (IPC) specification for sufficiently defect-free ENIG processing requires tightly controlled gold thickness distribution, with a lower mean than previously specified. Affinity ENIG 2.0 electroless nickel and immersion gold baths are formulated to work together, producing a process with a gold thickness standard deviation far below that of any competing system.
Reduction of Corrosion for Reliability
Affinity ENIG 2.0 is a highly stable, low-corrosion electroless nickel/immersion gold process developed with the needs of OEMs and quality engineers in mind. The benefits of Affinity ENIG 2.0 stem from its tightly controlled process variation compared to competing processes. Low variation results in savings due to reduced gold plating consumption.
Tight Nickel-Phosphorous Percent Distribution
Consistency is key. Affinity ENIG 2.0 features one of the most advanced electroless nickel baths available for electronics manufacturing. The temperature-resistant stabilizer and dummy-free operation help reduce operating costs, while the highly uniform phosphorous content prevents catastrophic reliability failures in soldered components.
Featured Application
Military & Aerospace
Affinity ENIG's consistent deposition characteristics, combined with high reliability, provide confidence for mission-critical products.