PackageBond
Adhesion promotion achieves proven reliability without delamination for panel level packaging applications.
Contact UsProduct Overview
PackageBond is the proven adhesion promotion system specifically designed for the demands of panel level packaging, delivering reliability at today’s high reflow temperatures. Production proven in high volume at premier semiconductor manufacturing facilities, PackageBond ensures that large, reconstituted panels withstand thermal and moisture stress without delamination, blistering, or warpage.
PackageBond is based on patented chemistry that preserves the long-term integrity of polymer and copper interfaces, ensuring robust performance through reflow, thermal cycling, and reliability testing.
Product Features
Proven Reliability at MSL-1
PackageBond enables proven reliability at MSL-1 with no delamination, blistering, or warpage in large reconstituted panels.
Improved Adhesion Performance
Significantly improves adhesion performance in advanced chip packages.
Prevents Cracking or Delamination
PackageBond features chemistry that stabilizes copper polymer interfaces, preventing cracks or delamination during thermal cycling and reflow.
Global Technical Expertise
Backed by MacDermid Alpha’s global technical expertise and validated in high-volume panel level packaging manufacturing.
Precision Bonding, Guaranteed Service and Support
PackageBond is the advanced adhesion technology designed specifically for panel level packaging. Through rigorous reliability testing with consistent results in high-volume manufacturing, PackageBond has proven to achieve MSL-1 performance. It is the optimum solution for high-density, multi-die panels and can be run in either conveyorized or batch mode.
Panel Level Packaging
PackageBond adhesion promotion system is specifically engineered for the demands of panel level packaging.
Product Documentation
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