CircuEtch 300
High-performance peroxide-sulfuric etchant system that ensures maximum circuit density, trace profile and excellent adhesion for panel level packaging applications.
Contact UsProduct Overview
CircuEtch 300 is a high-performance flash etching process for Semi-Additive Processing (SAP) in Integrated Circuit (IC) substrates and Panel Level Packaging (PLP). Designed for precision, it cleanly etches copper at the base of traces without undercut, preserving trace shapes and ensuring strong adhesion to the substrate.
This robust, stable process delivers consistent etch rates across a broad operating window, accommodating variations in copper type, sulfuric acid concentration, temperature, and additive levels. CircuEtch 300 excels in etching a variety of copper types including electroless and sputtered copper, carefully treating electroplated pattern plates to maintain critical circuit dimensions.
Product Features
Optimal Circuit Geometry and Adhesion
CircuEtch 300 provides vertical trace sidewalls without undercut for optimal circuit geometry and adhesion.
Reduced Surface Roughness
Reduced surface roughness improves electrical properties.
Predictable Etching Rate
CircuEtch 300 is capable of etching up to 5 μm/min of base layer copper at 30°C and provides a stable, predictable etching rate under a variety of conditions.
Ease of Maintenance
Simple peroxide-sulfuric based bath composition for ease of maintenance.
Flash Etching Process Technology for Excellent Trace Geometry
CircuEtch 300 is designed to provide a stable process that performs predictably and repeatedly. This results in critical dimensions and material properties being obtained from the line, with a high degree of precision and quality.
Semi-Additive Processing of IC Substrates and Panel Level Packaging
CircuEtch 300 is a highly stable process that precisely etches copper at the base of traces without undercut, maintaining trace shapes and adhesion to the substrate.
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