Affinity™ ENIG
Optimized process creates an extremely uniform nickel-phosphorous distribution and low variation in pad-to-pad gold thickness.
Contact UsProduct Overview
Each process step of Affinity Electroless Nickel/Immersion Gold (ENIG) is optimized to work together to create an extremely uniform nickel-phosphorous distribution and low variation in pad-to-pad gold thickness. As a result, the entire process is highly resistant to penetrating corrosion and conforms easily to all known specifications including the stringent IPC 4552 A and B.
Product Features
Developed with Six Sigma Methodology
Data driven approach from concept to mass production eliminates waste, improves yield and reliability by minimizing process variation.
Significant Cost of Ownership Improvements
Elimination of dummy waste, maximized bath life, reduced chemical waste and maintenance and best in class use of precious metals.
Reduced Corrosion
Consistently low electroless nickel corrosion providing the highest level of conformance to IPC 4552 A and B.
Tighter Gold Window and Dummy Free Operation
The latest Institute of Printed Circuit Boards (IPC) specification for sufficiently defect-free ENIG processing requires that the gold thickness distribution is tightly controlled around a lower mean than previously called for. Affinity ENIG 2.0 electroless nickel and immersion gold baths are formulated to work together to produce a process with a standard deviation in gold thickness far below that of any competing system.
Reduction of Corrosion for Reliability
Affinity ENIG 2.0 is a highly stable, low corrosion electroless nickel / immersion gold process developed with the needs of OEMs and quality engineers in mind. The benefits of Affinity ENIG 2.0 come from its highly tightened process variation compared to competing processes. Low variation means savings due to reduced gold plating consumption.
Tight Nickel-Phosphorous Percent Distribution
Consistency is everything. Affinity ENIG 2.0 comes with one of the most advanced electroless nickel baths sold for electronics manufacturing. The temperature resistant stabilizer and dummy free operation allow for savings in operating costs. The highly uniform phosphorous content prevents catastrophic failures in reliability of soldered components.
Featured Application
Military & Aerospace
Affinity ENIG's consistent deposition characteristics combined with high reliability gives confidence for mission critical products.