Affinity™ ENEPIG
Electroless-nickel electroless-palladium immersion-gold surface finish provides a foundation for strong wire bonding on IC substrates.
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Product Overview
The Affinity ENEPIG process is a simple-to-operate solution that provides uniform nickel, palladium, and gold deposits with high reliability for soldering and wire bonding applications at the lowest cost of ownership. The proprietary nickel, palladium, and gold baths offer chemical stability during intermittent operation without wasteful plate-out on equipment.
Product Features
Superior Wire Bond Performance and Solderability
The nickel and palladium deposits are consistently uniform, and when paired with hybrid gold deposition, deliver a corrosion-free, highly solderable, and wirebondable surface.
Corrosion Free Deposition
Affinity ENEPIG creates a surface that is corrosion-free, enhancing product reliability.
Significant Cost of Ownership Improvement
Cost improvements are achieved through extremely stable bath chemistry and simplified bath control, the elimination of dummy waste, and reduced chemical waste and maintenance.
Corrosion Observations Reduced to Zero
Hybrid gold deposition allows for improved gold thickness capability without total reliance on galvanic displacement of the Electroless Nickel (EN) deposit. The resultant Affinity ENEPIG surface is corrosion-free, thus eliminating reliability concerns associated with traditional systems.
Wire Bonding Performance
Affinity ENEPIG eliminates corrosion, delivering a high-quality finish and ensuring the highest reliability in soldering and wire bonding performance, even after prolonged shelf life. The performance of the wire bonding does not degrade with bath life and remains stable even after the coating has been subjected to multiple assembly reflow thermal exposures.
Excellent Ball Shear Solderability Performance
The highly solderable nickel-palladium-gold coating of Affinity ENEPIG provides consistent ball shear performance over long chemical bath life and multiple reflow operations. The process delivers these excellent solderability characteristics while also adhering to Institute of Printed Circuit Boards (IPC) thickness specifications, such as 4556 and its upcoming updated version, 4556A.
Featured Applications
Integrated Circuit (IC) Substrates
Affinity ENEPIG is designed for critical applications where six-sigma assembly performance and mission-critical reliability are required.